Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Yang-Kuao Kuo"'
Publikováno v:
Ceramics International. 48:8766-8772
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7eda82d9cedf305672502d6cabcf75db
https://doi.org/10.1016/j.ceramint.2022.01.131
https://doi.org/10.1016/j.ceramint.2022.01.131
Publikováno v:
ECS Meeting Abstracts. :1046-1046
In this study, we demonstrate breaking through the main obstacle to achieve perfect wafer bonding: the requirement of the surface needs to be very flat and smooth. Strictly, the roughness must be less than 0.5 Å. We use sintered aluminum nitride as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ff2fcd4f399ac16bb266931254f9c8e6
https://doi.org/10.1149/ma2022-01181046mtgabs
https://doi.org/10.1149/ma2022-01181046mtgabs
Publikováno v:
Atlas Journal of Materials Science. 1:30-37
As a ceramic with high economic value, aluminum nitride possesses high thermal conductivity, excellent electrical insulation, high mechanical strength and high melting temperature and these all are required in high technologies involving cooling, ins
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::56e12e376ad366d5115d014e4524ee4e
https://doi.org/10.5147/ajms.v1i2.120
https://doi.org/10.5147/ajms.v1i2.120
Autor:
Ming-Jer Jeng, Ting-Wei You, Sung-Cheng Hu, Yang-Kuao Kuo, Liann-Be Chang, Chia-I Yen, Chun-Te Wu
Publikováno v:
Thin Solid Films. 570:500-503
As a major step in the conduction of heat dissipation, wafer bonding significantly contributes to device reliability. This work presents the Cu–Sn eutectic bonding with a Mo buffer layer for light emitting diodes to increase its reliability. The co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cfba99a9218da67307059282b17312a0
https://doi.org/10.1016/j.tsf.2014.03.029
https://doi.org/10.1016/j.tsf.2014.03.029
Autor:
Yang-Kuao Kuo, Liann-Be Chang, Ke-Wei Pan, Chia-Yi Yen, Sung-Cheng Hu, Ming-Jer Jeng, Chun-Te Wu
Publikováno v:
Thin Solid Films. 570:496-499
Traditional white light light-emitting diode (LED) encapsulation is performed by mixed phosphors and silicone coating on LED die. However, this encapsulation with silicone coating incurs overheated temperatures and yellowing problem. Therefore, this
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8242097d20ee4262b7ff8c509a5b8de
https://doi.org/10.1016/j.tsf.2014.03.033
https://doi.org/10.1016/j.tsf.2014.03.033
Autor:
Yang-Kuao Kuo, Chen-Chi M. Ma, Kuo-Chi Yu, Chih-Chun Teng, Yi-Hsiuan Yu, Kai-Yia Chang, Hsi-Wen Tien
Publikováno v:
Journal of the Taiwan Institute of Chemical Engineers. 45:674-680
In this study, spongy iron powders (SIPs) that possess a high specific area (1.57 m2/g) were successfully prepared and used for microwave absorption. The specific area was approximately two times higher than that of commercial carbonyl iron powders (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::412ff503fdf97041c89e661aa66b44aa
https://doi.org/10.1016/j.jtice.2013.05.005
https://doi.org/10.1016/j.jtice.2013.05.005
Autor:
Lu Lin Li, Yang Kuao Kuo
Publikováno v:
Advanced Materials Research. :2822-2825
A simple electrodeposition approach has been developed to fabricate Pt and Cu nanostructures via inorganic salt and surfactant to control the shape, size, and distribution of the nanomaterials. The Pt thin film fabricated by cyclic electrodeposition
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c4340cadcc8663214f49e96f3e5f61b
https://doi.org/10.4028/www.scientific.net/amr.807-809.2822
https://doi.org/10.4028/www.scientific.net/amr.807-809.2822
Autor:
Yang-Kuao Kuo
Publikováno v:
Heat and Mass Transfer. 47:1395-1399
Thermal conduction and thermal convection are two major cooling methods. The experiment applies these two methods simultaneously to cool photo-masks. The combination of thermal conduction and thermal convection can solve the problems of thermal expan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6808fd611363917ece04e64d426a7094
https://doi.org/10.1007/s00231-011-0798-4
https://doi.org/10.1007/s00231-011-0798-4
Autor:
Chuen-Guang Chao, Yang-Kuao Kuo
Publikováno v:
Microelectronics Journal. 37:759-764
The issue of how to transfer a pattern onto a wafer during photolithography is very important. Normally, the resist is treated as a pattern-transferring medium. Such a medium should have a very smooth surface to reduce the focus error. In this experi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::00d2466e2c7079eddc339ed62c123495
https://doi.org/10.1016/j.mejo.2005.10.009
https://doi.org/10.1016/j.mejo.2005.10.009
Publikováno v:
Materials Science in Semiconductor Processing. 8:483-490
In the photolithography processing of semiconductor, the line width becomes smaller and smaller. Therefore, the requirements of process window are stricter than before. Among them, the control of focus and exposure dose is one of the most important f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4bf33cb54864445c21fd80a279c254d3
https://doi.org/10.1016/j.mssp.2004.10.001
https://doi.org/10.1016/j.mssp.2004.10.001