Zobrazeno 1 - 10
of 69
pro vyhledávání: '"Yang, I‐Hsuan"'
Autor:
Yang, I-Hsuan, Kuan, Che-Yung, Zhang, Sheng-Long, Chen, Zhi-Yu, Li, Chi-Han, Liang, Ya-Jyun, Kuo, Wei-Ting, Chang, Chia-Ting, Lin, Jason, Hsieh, Hsing-Pang, Chang, Jang-Yang, Lin, Feng-Huei
Publikováno v:
In European Polymer Journal 24 June 2024 214
Autor:
Yang, I-Hsuan, 楊易軒
107
This study proposes the Twin-Tree Structure Model to model asset value and price an American-type with the early exercise Catastrophe Equity Put options (CatEPut). In this thesis, we explore the Reference Entity Risk with price endogeneity.
This study proposes the Twin-Tree Structure Model to model asset value and price an American-type with the early exercise Catastrophe Equity Put options (CatEPut). In this thesis, we explore the Reference Entity Risk with price endogeneity.
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/tbv3z7
Autor:
Yang, I-Hsuan, Szabó, László, Sasaki, Makoto, Uto, Koichiro, Henzie, Joel, Lin, Feng-Huei, Samitsu, Sadaki, Ebara, Mitsuhiro
Publikováno v:
In International Journal of Biological Macromolecules 31 December 2023 253 Part 3
Akademický článek
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Autor:
Yang, I-Hsuan, Sasaki, Makoto, Takahashi, Kaho, Uto, Koichiro, Lin, Feng-Huei, Ebara, Mitsuhiro
Publikováno v:
In Journal of Membrane Science 5 October 2023 683
Akademický článek
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K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Yang, I-Hsuan, Kuan, Che-Yung, Chen, Zhi-Yu, Li, Chi-Han, Chi, Chih-Ying, Lin, Yu-Ying, Liang, Ya-Jyun, Kuo, Wei-Ting, Li, Yi-An, Lin, Feng-Huei
Publikováno v:
In Materials Today Bio June 2022 15
Autor:
Lin, Jhih-Ni, Kuan, Che-Yung, Chang, Chia-Ting, Chen, Zhi-Yu, Kuo, Wei-Ting, Lin, Jason, Lin, Yu-Ying, Yang, I.-Hsuan, Lin, Feng-Huei
Publikováno v:
Journal of Biological Engineering; 11/12/2024, Vol. 18 Issue 1, p1-11, 11p
Autor:
Chen, Zhi-Yu, Chen, Shih-Heng, Chen, Shih-Hsien, Chou, Pang-Yun, Kuan, Che-Yung, Yang, I-Hsuan, Chang, Chia-Tien, Su, Yi-Chun, Lin, Feng-Huei
Publikováno v:
Biomacromolecules; 9/9/2024, Vol. 25 Issue 9, p5786-5797, 12p
Autor:
Yang, I-Hsuan, 楊翊璿
101
The application of plasma is very common in industry, like film deposition, etching, cleaning, bacteria killing, surface modification, and so on. In the field of plasma cleaning, it's often used for removal of carbon contaminant when using e
The application of plasma is very common in industry, like film deposition, etching, cleaning, bacteria killing, surface modification, and so on. In the field of plasma cleaning, it's often used for removal of carbon contaminant when using e
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/05751507708880753795