Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Yan-Yu Liou"'
Publikováno v:
Micromachines, Vol 14, Iss 8, p 1506 (2023)
The multi-chiplet technique is expected to be a promising solution to achieve high-density system integration with low power consumption and high usage ratio. This technique can be integrated with a glass interposer to accomplish a competitive low fa
Externí odkaz:
https://doaj.org/article/0bbb9d2a3ce74f9491f37ca4576f9875
Publikováno v:
Materials, Vol 15, Iss 20, p 7357 (2022)
In glass interposer architecture and its assembly process, the mechanical responses of interposer structure under thermocompression process-induced thermal loading and generated shrinkage of molding material are regarded as a major reliability issue.
Externí odkaz:
https://doaj.org/article/9bdbbd6cca9f410dbfb0ec54f53b3066
Autor:
Yan-Yu Liou, 劉彥禹
104
Cause of power modules has higher and higher loading power day by day, the temperature of working chip has risen. The height temperature let the power modules have to worry about how to cooling down. Therefore, some people have do some exper
Cause of power modules has higher and higher loading power day by day, the temperature of working chip has risen. The height temperature let the power modules have to worry about how to cooling down. Therefore, some people have do some exper
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/84689698163644373646
Autor:
Chang-Chun Lee, Yan-Yu Liou
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 18:639-642
A generalized solution for the bending stress/strain expression of flexible display composed of multi-stacked thin films is presented in this letter. Flexible display comprises an arbitrary number of films combined with dissimilar thicknesses and lin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c95beddc80ec187ef70805001aad2737
https://doi.org/10.1109/tdmr.2018.2878485
https://doi.org/10.1109/tdmr.2018.2878485
Autor:
Chang-Chun Lee, Yan-Yu Liou, Che-Pei Chang, Pei-Chen Huang, Chih-Yung Huang, Kuan-Chou Chen, Yi-Jiun Lin
Publikováno v:
Surface and Coatings Technology. 434:128225
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::836d900a832e7f26f034e70eec5815bb
https://doi.org/10.1016/j.surfcoat.2022.128225
https://doi.org/10.1016/j.surfcoat.2022.128225
Publikováno v:
Science of Advanced Materials. 9:17-21
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7c62539e07911223604b54ac89fb018
https://doi.org/10.1166/sam.2017.2571
https://doi.org/10.1166/sam.2017.2571
Autor:
Puru Bruce Lin, Pei-Chen Huang, Yu-Hua Chen, Fussen Hsu, Cheng-Ta Ko, Yan-Yu Liou, Chang-Chun Lee
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
On the urgent multi-function requirements of mobile products and internet of things, a more than Moore's rule becomes a major concern in accordance with the scaling limitation of advanced devices. Accordingly, the architecture of fan out panel-level
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10e3ffe834edd8a5ae99359ad227b291
https://doi.org/10.1109/ectc.2019.00217
https://doi.org/10.1109/ectc.2019.00217
Publikováno v:
Surface and Coatings Technology. 303:226-231
Organic light-emitting diode (OLED) display is considered one of the promising portable electronic devices given that the application requirements for the Internet of Things are necessary. Composed of multi-stacked thin films, OLED display needs to b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf2455c5e2d64c89cda04a0e0ec6ec2c
https://doi.org/10.1016/j.surfcoat.2016.03.041
https://doi.org/10.1016/j.surfcoat.2016.03.041
Autor:
Hsing-Ning Liu, Tao-Chih Chang, Ren-Chin Cheng, Chien-Ping Wang, Chang-Chun Lee, Yan-Yu Liou, Yu-Min Lin
Publikováno v:
Microelectronic Engineering. 156:30-36
To resolve and simplify the critical assembly issue regarding the interposer of 3D integrated circuits (3D-ICs), a prototype of an embedded interposer carrier (EIC) is developed and demonstrated. However, the serious warping induced during the lamina
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27ecb77a6009834f291bfd091ba552dc
https://doi.org/10.1016/j.mee.2016.01.039
https://doi.org/10.1016/j.mee.2016.01.039
Autor:
Yan-Yu Liou, Yu-Min Lin, Chau-Jie Zhan, Chien-Ping Wang, Chang-Chun Lee, Tao-Chih Chang, Chia-Ping Hsieh
Publikováno v:
Microelectronic Engineering. 156:24-29
This study presents a process for wafer handling and robust assembly, which is a novel pre-molding technology applied to assembled stacked modules prior to chip thinning. These steps aim to overcome severe challenges of achieving extra-thin thickness
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a0beb58b27d36785363881261ad81c3
https://doi.org/10.1016/j.mee.2016.01.040
https://doi.org/10.1016/j.mee.2016.01.040