Zobrazeno 1 - 10
of 74
pro vyhledávání: '"Yan-Jun Wan"'
Autor:
Yu-Ying Shi, Si-Yuan Liao, Qiao-Feng Wang, Xin-Yun Xu, Xiao-Yun Wang, Xin-Yin Gu, You-Gen Hu, Peng-Li Zhu, Rong Sun, Yan-Jun Wan
Publikováno v:
Nano-Micro Letters, Vol 16, Iss 1, Pp 1-14 (2024)
Highlights A strategy based on metal-organic decomposition is proposed to enhance the tube-tube interactions of carbon nanotubes (CNTs). The robust tube-tube interactions of CNTs enhance both EMI shielding performance and mechanical properties of CNT
Externí odkaz:
https://doaj.org/article/5fc34887c05f40909f652bb20a03b2df
Autor:
Fukang Deng, Jianhong Wei, Yadong Xu, Zhiqiang Lin, Xi Lu, Yan-Jun Wan, Rong Sun, Ching-Ping Wong, Yougen Hu
Publikováno v:
Nano-Micro Letters, Vol 15, Iss 1, Pp 1-15 (2023)
Highlights A flexible freestanding TaS2 film (thickness = 3.1 μm) exhibits an ultralow void ratio of 6.01%, an ultra-high electrical conductivity of 2,666 S cm−1, an electromagnetic interference shielding effectiveness (EMI SE) of 41.8 dB, an abso
Externí odkaz:
https://doaj.org/article/7b07bcb225ba41c9950ded38b931b26b
Autor:
Yan-Jun Wan, Li Xu, Wen-Ting Song, Yu-Qi Liu, Li-Chao Wang, Ming-Bo Zhao, Yong Jiang, Lian-Ying Liu, Ke-Wu Zeng, Peng-Fei Tu
Publikováno v:
Frontiers in Pharmacology, Vol 10 (2019)
Background:Caesalpinia sappan L. (C. sappan) is a traditional Chinese medicinal plant. The dried heartwood of C. sappan (also known as Sappan wood) has been widely used for the folkloric medical treatment of ischemic cerebral stroke in China. However
Externí odkaz:
https://doaj.org/article/bc1bb147ffd94c878525b63bcbe288b9
Publikováno v:
ACS Applied Nano Materials. 5:13509-13518
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2983c0ec892aceeedba629a1a949801a
https://doi.org/10.1021/acsanm.2c03071
https://doi.org/10.1021/acsanm.2c03071
Autor:
Xue Tan, Te-Huan Liu, Wenjiang Zhou, Qilong Yuan, Junfeng Ying, Qingwei Yan, Le Lv, Lu Chen, Xiangze Wang, Shiyu Du, Yan-Jun Wan, Rong Sun, Kazuhito Nishimura, Jinhong Yu, Nan Jiang, Wen Dai, Cheng-Te Lin
Publikováno v:
ACS Nano. 16:9254-9266
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::94170cdadd5d3deaa681807aa30ddf0c
https://doi.org/10.1021/acsnano.2c01716
https://doi.org/10.1021/acsnano.2c01716
Autor:
Zhiqiang Lin, Xierong Zeng, Tao Zhao, Rong Sun, Youkang Shen, Yougen Hu, Yan Jun Wan, Jianhong Wei, Yadong Xu
Publikováno v:
Carbon. 186:9-18
Endowing electromagnetic interference (EMI) shielding foams with ultralow density and dynamic stable structure is crucial yet challenging. Here, we propose a facile one-step thermal treatment strategy to fabricate lightweight silver/reduced graphene
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77aad6747e6dae247d93c27d4c5d7e77
https://doi.org/10.1016/j.carbon.2021.09.068
https://doi.org/10.1016/j.carbon.2021.09.068
Autor:
Xiao-Yun Wang, Si-Yuan Liao, Yan-Jun Wan, Peng-Li Zhu, You-Gen Hu, Tao Zhao, Rong Sun, Ching-Ping Wong
Publikováno v:
Journal of Materials Chemistry C. 10:44-72
Novel structure design and shielding mechanism of various shielding materials are critically reviewed. Measurement methods of far-field and near-field shielding are presented. Challenges and future perspectives for shielding materials are discussed.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9adbb33a1131e5197d24f6e86a5b101
https://doi.org/10.1039/d1tc04702g
https://doi.org/10.1039/d1tc04702g
Autor:
Xiao‐Yun Wang, Si‐Yuan Liao, Hai‐Peng Huang, Qiao‐Feng Wang, Yu‐Ying Shi, Peng‐Li Zhu, You‐Gen Hu, Rong Sun, Yan‐Jun Wan
Publikováno v:
Small Methods. 7
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab3c56111699611cde3f8d25ba10d2e2
https://doi.org/10.1002/smtd.202201694
https://doi.org/10.1002/smtd.202201694
Autor:
Zhen Zhang, Jianda Wang, Jian Shang, Yadong Xu, Yan‐Jun Wan, Zhiqiang Lin, Rong Sun, Yougen Hu
Publikováno v:
Small (Weinheim an der Bergstrasse, Germany).
Multifunctional thermal management materials with highly efficient electromagnetic wave (EMW) absorption performance are urgently required to tackle the heat dissipation and electromagnetic interference issues of high integrated electronics. However,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::14c8a9e893fdc459e4279dcfda45c0a1
https://pubmed.ncbi.nlm.nih.gov/36437045
https://pubmed.ncbi.nlm.nih.gov/36437045
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cd50aaafcb7b489f08e56ede149dccfb
https://doi.org/10.1109/icept56209.2022.9872636
https://doi.org/10.1109/icept56209.2022.9872636