Zobrazeno 1 - 10
of 32
pro vyhledávání: '"Yan-Jun Fan"'
Publikováno v:
In Engineering Geology 24 February 2015 186:34-43
Objective: In this study, we tested the hypothesis that circulating factors produced during exercise regulate the expression of ABCC4, ABCG2, URAT1, and GLUT9 in normal rat kidney and NRK-52E cells and their relationship with NF-κB and NRF-2. Method
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::166a9d8853253d985630e21debf9be36
https://doi.org/10.21203/rs.3.rs-1797836/v1
https://doi.org/10.21203/rs.3.rs-1797836/v1
Autor:
Yan-Jun Fan, John H. Lau, Kai-Ming Yang, Hsing-Ning Liu, Tzvy-Jang Tseng, Eagle Lin, Puru Bruce Lin, Curry Lin, Leo Chang, Jean-Jou Chen, Po-Chun Huang, Cheng-Ta Ko, Tim Xia, Winnie Lu, Chia-Yu Peng
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 18:29-39
In this study, the reliability of the solder joints of a heterogeneous integration of one large chip (10 × 10 mm) and two smaller chips (7 × 5 mm) by a fan-out method with a redistribution layer-first substrate fabricated on a 515 × 510-mm panel i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b8a304f5b03066bbe5ed60b583c39ef
https://doi.org/10.4071/imaps.1419800
https://doi.org/10.4071/imaps.1419800
Autor:
Tim Xia, David Cheng, Kai-Ming Yang, Yan-Jun Fan, Puru Bruce Lin, Tzvy-Jang Tseng, John H. Lau, Winnie Lu, Cheng-Ta Ko, Chia-Yu Peng, Curry Lin, Leo Chang, Hsing Ning Liu, Eagle Lin
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 18:67-80
In this study, the reliability of the solder joints of a six-side molded panel-level chip-scale package (PLCSP) is investigated. Emphasis is placed on the thermal cycling test (−55°C Δ 125°C, 50-min cycle) of the six-side molded PLCSP on a print
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::462aa0ceca7feed717806ec4f7862fcc
https://doi.org/10.4071/imaps.1421341
https://doi.org/10.4071/imaps.1421341
Autor:
Puru Bruce Lin, Jean-Jou Chen, John H. Lau, Cheng-Ta Ko, Po-Chun Huang, Curry Lin, Yan-Jun Fan, Leo Chang, Kai-Ming Yang, Tim Xia, Chia-Yu Peng, Winnie Lu, Eagle Lin, Hsing-Ning Liu, Tzvy-Jang Tseng
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this study, the reliability of the solder joints of a heterogeneous integration of one large chip and two smaller chips by a fan-out method with a redistribution-layer (RDL)-first substrate fabricated on a panel is investigated. Emphasis is placed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2eb964bfd7afa7a2f47dd5d5c3156c65
https://doi.org/10.1109/ectc32696.2021.00067
https://doi.org/10.1109/ectc32696.2021.00067
Autor:
Hsing Ning Liu, Puru Bruce Lin, Winnie Lu, Tzvy-Jang Tseng, Curry Lin, Leo Chang, Yan-Jun Fan, John H. Lau, Cheng-Ta Ko, Eagle Lin, David Cheng, Tim Xia, Kai-Ming Yang, Chia-Yu Peng
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this study, the reliability of the solder joints of a 6-side molded panel-level chip-scale package (PLCSP) is investigated. Emphasis is placed on the thermal cycling test ( $-55^{\circ}\mathrm{C}\leftrightarrows 125^{\circ}\mathrm{C}$ , 50-minute
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2e78774b4003e2e3b3e8d2bfe47f67d
https://doi.org/10.1109/ectc32696.2021.00148
https://doi.org/10.1109/ectc32696.2021.00148
Autor:
Xiao Hui Zhao, Yan Jun Fan
Publikováno v:
Applied Mechanics and Materials. 778:59-62
Ultrasonic shot peening can be used to strengthen mechanical parts. Its equipment structure is compact, which is convenient for incorporated into production line. It is fitting to facilitate operation and high reproducibility without dust pollution a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a387706fe68d6aefc92a8a08ce058a53
https://doi.org/10.4028/www.scientific.net/amm.778.59
https://doi.org/10.4028/www.scientific.net/amm.778.59
Publikováno v:
Applied Mechanics and Materials. :905-910
An improved new damper was presented. The mechanical properties of the damper were conducted by the numerical simulation method under the cyclic loading. Also, the seismic mitigation effectiveness of the damper was verified though Time History Analys
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5264b7abab852677f878a75e6f44ed4b
https://doi.org/10.4028/www.scientific.net/amm.744-746.905
https://doi.org/10.4028/www.scientific.net/amm.744-746.905
Autor:
Lau, John H., Cheng-Ta Ko, Chia-Yu Peng, Tzvy-Jang Tseng, Kai-Ming Yang, Tim Xia, Lin, Puru Bruce, Lin, Eagle, Leo Chang, Hsing Ning Liu, Lin, Curry, Yan-Jun Fan, Cheng, David, Lu, Winnie
Publikováno v:
Journal of Microelectronic & Electronic Packaging; 2021, Vol. 18 Issue 2, p67-80, 14p
Autor:
Lau, John H., Cheng-Ta Ko, Chia-Yu Peng, Kai-Ming Yang, Tim Xia, Lin, Puru Bruce, Jean-Jou Chen, Po-Chun Huang, Tzvy-Jang Tseng, Lin, Eagle, Leo Chang, Lin, Curry, Yan-Jun Fan, Hsing-Ning Liu, Lu, Winnie
Publikováno v:
Journal of Microelectronic & Electronic Packaging; 2021, Vol. 18 Issue 2, p29-39, 11p