Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Yan Wen Tsau"'
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ee1c32eeb6c1c9880d0ca24d9568d2ea
https://doi.org/10.1109/eurosime56861.2023.10100784
https://doi.org/10.1109/eurosime56861.2023.10100784
Autor:
Yan Wen Tsau, Joke De Messemaeker, Abdellah Salahouelhadj, Mario Gonzalez, Liesbeth Witters, Boyao Zhang, Marc Seefeldt, Eric Beyne, Ingrid De Wolf
Publikováno v:
Microelectronics Reliability. 138:114716
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac9a67ab7ad62a79983dc57dc5d48102
https://doi.org/10.1016/j.microrel.2022.114716
https://doi.org/10.1016/j.microrel.2022.114716
Publikováno v:
Materials Chemistry and Physics. 218:147-153
This study investigated the failure mechanism of Ag-4Pd wire bonded on Al metallization under chlorine corrosive environments after high temperature storage tests (HTST) and thermal cycle tests (TCT). Results show that as-bonded samples encountered t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47568b5025385036601114b3bf63f318
https://doi.org/10.1016/j.matchemphys.2018.07.021
https://doi.org/10.1016/j.matchemphys.2018.07.021