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pro vyhledávání: '"Yaman Yaseen Manaserh"'
Autor:
Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia
Publikováno v:
Journal of Electronic Packaging. 145
More than ever before, data centers must deploy robust thermal solutions to adequately host the high-density and high-performance computing that is in high demand. The newer generation of central processing units (CPUs) and graphics processing units
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96a14c8c801d553ac738ddecedbfe264
https://doi.org/10.1115/1.4054972
https://doi.org/10.1115/1.4054972
