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pro vyhledávání: '"Yamagishi Katsuji"'
Autor:
Yamagishi Katsuji, Nobuyuki Ogawa, Hitoshi Onozeki, Kenichi Ikeda, Takahiro Tanabe, Takayuki Suzuki, Inoue Tsubasa
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
The demand for downsized and light-weighted electronic parts has become stronger to realize the higher electrical performance and smaller size of electronic equipment. Thus, the package substrate used in electronics is demanded to be thinner and high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92d23ea33c3b41202c274311f947f6f7
https://doi.org/10.1109/ectc.2013.6575743
https://doi.org/10.1109/ectc.2013.6575743
Autor:
Onozeki, Hitoshi, Inoue, Tsubasa, Yamagishi, Katsuji, Tanabe, Takahiro, Suzuki, Takayuki, Ikeda, Kenichi, Ogawa, Nobuyuki
Publikováno v:
2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p1320-1324, 5p