Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Yamada Tadatomo"'
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
This paper reports on a novel chip placement technology for Fan-out WLP using expansion technology and self-assembly technique. In a preceding paper, we reported that we have developed the novel tape expansion machine which can expand the tape in fou
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5fdf5b4b54fab47596da4010fa58a2d5
https://doi.org/10.1109/ectc32696.2021.00178
https://doi.org/10.1109/ectc32696.2021.00178
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
This paper describes the results of novel stress-strain curve measuring method for high expansion tape. We previously reported that we have developed the novel tape expansion machine with a new function allowing that tapes can be expanded in four dir
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c27e21ef789b5a1c95aa7e7c6cbc8efc
https://doi.org/10.1109/ectc32862.2020.00171
https://doi.org/10.1109/ectc32862.2020.00171
Publikováno v:
3DIC
This paper repots on a novel pick-up and place process for FO-WLP using high expansion tape and tape expansion machine device. We previously reported that we have developed the novel tape expansion machine with a new function allowing that tapes can
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::78816d2b496eaa1658cb151f72dd6a1c
https://doi.org/10.1109/3dic48104.2019.9058827
https://doi.org/10.1109/3dic48104.2019.9058827