Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Yamada Kunpei"'
Autor:
Hikari Murai, Makoto Kato, Hiroyuki Fukai, Youichi Kaneko, Fujimoto Daisuke, Yamada Kunpei, Nobuyuki Ogawa
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
As electronic parts increase its performance and miniaturize in its size, package substrates are demanded to be thinner and higher in density. But higher density substrates using insulating films give higher warpage values when they are very thin, du
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e64840f2d7880040665539ee32328dc
https://doi.org/10.1109/ectc.2011.5898542
https://doi.org/10.1109/ectc.2011.5898542
Publikováno v:
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).
A CPU chip-on-board module for low and midrange computers is described. The module consists of a CPU bare chip, 24 SRAM's packaged in SOJ packages, and some decoupling capacitors. The module substrate is a printed circuit board (PCB) made of bismalei
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::85065388652c591a845568e1ef1e9384
https://doi.org/10.1109/ectc.1993.346859
https://doi.org/10.1109/ectc.1993.346859
Publikováno v:
40th Conference Proceedings on Electronic Components and Technology.
A low-thermal-resistance and high-speed pin-grid-array (PGA) package with low-inductance power lines was proposed, and its feasibility was confirmed. To obtain low-inductance power lines, the wiring system in the package kept power-line layers and si
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b5d9b4f88c35d34801dbff0ef9f89f5
https://doi.org/10.1109/ectc.1990.122210
https://doi.org/10.1109/ectc.1990.122210