Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Yamada Kumpei"'
Publikováno v:
MRS Advances. 4:801-806
We attempt to reveal how electrolyte additives affect the structural evolution of the solid electrolyte interphase (SEI) film on the anode surface of a lithium-ion secondary battery. Employing the hybrid Monte-Carlo/molecular-dynamics method, we theo
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
In plane collective bonding by NCF-TCB with the film inserted between the die and the substrate, which had a significant potential to enhance the productivity, was studied. PTFE and the newly developed film which consisted of thermosetting resin laye
Autor:
Tetsuro Iwakura, Fujimoto Daisuke, Hikari Murai, Yamada Kumpei, Youichi Kaneko, Hiroshi Simizu
Publikováno v:
2013 3rd IEEE CPMT Symposium Japan.
As electronic parts increase its performance and miniaturize the size, package substrates are demanded to be thinner as well as higher in density. Thin packages such as Chip Scale Package (CSP) require high elastic modulus and low coefficient of ther
Autor:
Yamada, Kumpei, Fujimoto, Daisuke, Iwakura, Tetsuro, Murai, Hikari, Kaneko, Youichi, Simizu, Hiroshi
Publikováno v:
2013 3rd IEEE CPMT Symposium Japan; 2013, p1-5, 5p