Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Ya-Yu Hsieh"'
Autor:
Ju-Sheng Shieh, Yu-Tang Chin, Hsien-Chung Chiu, Ya-Yu Hsieh, Hui-Rong Cheng, Hai Gu, Fung-Wei Chang
Publikováno v:
International Journal of Molecular Sciences, Vol 23, Iss 23, p 15010 (2022)
Mesenchymal stem cell (MSC)-derived extracellular vesicles (exosomes) possess regeneration, cell proliferation, wound healing, and anti-senescence capabilities. The functions of exosomes can be modified by preconditioning MSCs through treatment with
Externí odkaz:
https://doaj.org/article/019d7165d71845669d083ce3e777dba3
Autor:
Ya-Yu Hsieh, 謝雅宇
98
This present study applies revised Jensen’s (1986) Free Cash Flow Hypothesis to investigate whether top managers pursuit their private benefits by using research and development (hereafter R&D) increases, and the effect on abnormal stock re
This present study applies revised Jensen’s (1986) Free Cash Flow Hypothesis to investigate whether top managers pursuit their private benefits by using research and development (hereafter R&D) increases, and the effect on abnormal stock re
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/90346218494571388523
Autor:
Ya-Yu Hsieh, 謝雅玉
93
This study aims to dig out a solution of PDMS microchip has an extreme hydrophobic surface in order to obtain a permanent hydrophilic surface and resistance to protein absorption, which can be made by inducing utilize the various polymers for
This study aims to dig out a solution of PDMS microchip has an extreme hydrophobic surface in order to obtain a permanent hydrophilic surface and resistance to protein absorption, which can be made by inducing utilize the various polymers for
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/82985508166621534202
Autor:
Yun Chih Tsai, Jia Rung He, Ping Feng Yang, Chun Han Hsu, Ya Yu Hsieh, Aswaghosh Loganathan, Hong Ping Lin
Publikováno v:
Journal of the Taiwan Institute of Chemical Engineers. 78:493-499
The present study focused on the preparation and characterization of a bio-based carbon-silica material derived from rice husk agricultural waste and its function in epoxy matrix for electronic packaging applications. X-ray diffraction (XRD) analysis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69de5260ec554e7d651ad9f6975a6335
https://doi.org/10.1016/j.jtice.2017.06.010
https://doi.org/10.1016/j.jtice.2017.06.010
Autor:
Chin Zen Huang, Hong Ping Lin, Yun Chih Tsai, Aswaghosh Loganathan, Ya Yu Hsieh, Chun Han Hsu
Publikováno v:
Journal of the Chinese Chemical Society. 64:1035-1040
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5485f1bb4a2063891873d6802292f220
https://doi.org/10.1002/jccs.201700131
https://doi.org/10.1002/jccs.201700131
Publikováno v:
Journal of the Chinese Chemical Society. 64:427-433
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5824b3c4456aedd22f70ad87306d866
https://doi.org/10.1002/jccs.201600827
https://doi.org/10.1002/jccs.201600827
Publikováno v:
Journal of Applied Polymer Science. 134
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8dc6ec5de563ffee3ac83e88d0570fb
https://doi.org/10.1002/app.44699
https://doi.org/10.1002/app.44699
Publikováno v:
Applied Surface Science. 256:6908-6913
Fluorinated compounds are commonly used for anti-stick coating but it is difficult to inspect the coverage of the coating without expensive instruments. Herein, we demonstrated that the 5-(perfluorooctylthio)acetamidofluorescein (5-FOAF) probe can be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fde640fe5e7d2b74e345a796ff4ba322
https://doi.org/10.1016/j.apsusc.2010.05.002
https://doi.org/10.1016/j.apsusc.2010.05.002
Atomistic simulation analysis for influence of organic PA types on PA/UF adhesion in 2.5D IC package
Autor:
Mei-Ling Wu, Ping-Feng Yang, Ya-Yu Hsieh, Chih-Pin Hung, Ying-Xu Lu, Chang-Chi Lee, Chung-Ting Wang
Publikováno v:
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
2.5D IC is an important transition product of 3D IC in the next generation. It has very important commercial value. However, at present 2.5D IC package process has numerous issues that need to be overcome, especially for interface delamination caused
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f37c4565d257e69c7ebc82abc2a8082
https://doi.org/10.1109/impact.2014.7048419
https://doi.org/10.1109/impact.2014.7048419