Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Ya Yu Hsieh"'
Autor:
Ju-Sheng Shieh, Yu-Tang Chin, Hsien-Chung Chiu, Ya-Yu Hsieh, Hui-Rong Cheng, Hai Gu, Fung-Wei Chang
Publikováno v:
International Journal of Molecular Sciences; Volume 23; Issue 23; Pages: 15010
Mesenchymal stem cell (MSC)-derived extracellular vesicles (exosomes) possess regeneration, cell proliferation, wound healing, and anti-senescence capabilities. The functions of exosomes can be modified by preconditioning MSCs through treatment with
Autor:
Yun Chih Tsai, Jia Rung He, Ping Feng Yang, Chun Han Hsu, Ya Yu Hsieh, Aswaghosh Loganathan, Hong Ping Lin
Publikováno v:
Journal of the Taiwan Institute of Chemical Engineers. 78:493-499
The present study focused on the preparation and characterization of a bio-based carbon-silica material derived from rice husk agricultural waste and its function in epoxy matrix for electronic packaging applications. X-ray diffraction (XRD) analysis
Autor:
Chin Zen Huang, Hong Ping Lin, Yun Chih Tsai, Aswaghosh Loganathan, Ya Yu Hsieh, Chun Han Hsu
Publikováno v:
Journal of the Chinese Chemical Society. 64:1035-1040
Publikováno v:
Journal of the Chinese Chemical Society. 64:427-433
Publikováno v:
Journal of Applied Polymer Science. 134
Publikováno v:
Applied Surface Science. 256:6908-6913
Fluorinated compounds are commonly used for anti-stick coating but it is difficult to inspect the coverage of the coating without expensive instruments. Herein, we demonstrated that the 5-(perfluorooctylthio)acetamidofluorescein (5-FOAF) probe can be
Atomistic simulation analysis for influence of organic PA types on PA/UF adhesion in 2.5D IC package
Autor:
Mei-Ling Wu, Ping-Feng Yang, Ya-Yu Hsieh, Chih-Pin Hung, Ying-Xu Lu, Chang-Chi Lee, Chung-Ting Wang
Publikováno v:
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
2.5D IC is an important transition product of 3D IC in the next generation. It has very important commercial value. However, at present 2.5D IC package process has numerous issues that need to be overcome, especially for interface delamination caused
Autor:
Ya-Yu Hsieh, 謝雅宇
98
This present study applies revised Jensen’s (1986) Free Cash Flow Hypothesis to investigate whether top managers pursuit their private benefits by using research and development (hereafter R&D) increases, and the effect on abnormal stock re
This present study applies revised Jensen’s (1986) Free Cash Flow Hypothesis to investigate whether top managers pursuit their private benefits by using research and development (hereafter R&D) increases, and the effect on abnormal stock re
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/90346218494571388523
Publikováno v:
2007 International Microsystems, Packaging, Assembly and Circuits Technology.
A major factor that affects the reliability and production yield of green packages is the adhesion between green molding compound and encapsulation mold. The non-stick coating on molds by physical vapor deposition (PVD) has been regarded as an altern