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Autor:
YH James Lim, Ee Jan Khor, Chai Wah Ng, Ramasamy Chockalingam, Aniketha Udupa Kuppar, Xu Zeng, Juan Boon Tan, H. Walter Yao
Publikováno v:
2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Stress Induced Voiding of a nose type Single Via is studied. Typical nose type single via stress voiding structure has top and bottom wide metal plates originating from the pads and tapering to a narrow metal line connected by single via enabling the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7b150365d3b9587593b0349929faa01d
https://doi.org/10.1109/ipfa.2018.8452516
https://doi.org/10.1109/ipfa.2018.8452516
