Zobrazeno 1 - 10
of 326
pro vyhledávání: '"Y.-H. Pao"'
Publikováno v:
Ultrasonics. 49:4-9
Based on Mindlin’s plate theory, the frequency spectra for flexural and thickness-shear vibrations of a finite beam-plate with different combinations of boundary conditions are presented and studied. Comparing them with the dispersion curves of the
Publikováno v:
Journal of Sound and Vibration. 317:716-738
The formulation of reverberation-ray matrix analysis has been proposed to study wave propagation in planar frames. It is applied here to modal analysis of complex three-dimensional framed structures, optionally with lumped masses and/or elastic suppo
Publikováno v:
European Transactions on Electrical Power. 3:241-248
The Transient Energy Function (TEF) method has been intensely investigated over the last decade as a reliable and accurate tool for transient stability assessment of multimachine power systems. In this paper we propose the Potential Energy Boundary S
Akademický článek
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Autor:
Baofu Duan, Y.-H. Pao
Publikováno v:
IFAC Proceedings Volumes. 33:37-41
In principle, autonomous decision-making and control can be implemented efficiently in reflex mode with use of neural networks. In practice there are situations where the very strategy of decision or control needs to be varied in accordance with circ
Publikováno v:
IFAC Proceedings Volumes. 33:43-48
In previous work we reported on materials design and property estimation using empirical or ordinal representation approaches (Pao et al., 1999, Pao et al., 2000). In this paper, we report in detail on a Basic Concepts approach, which combines some o
Publikováno v:
Journal of Electronic Packaging. 119:204-207
Publikováno v:
Journal of Electronic Packaging. 118:235-243
Publikováno v:
Journal of Electronic Packaging. 116:184-190
Printed circuit boards populated with twenty-five 0.4 mm pitch, 256-pin plastic quad flat packs (QFP) containing no-clean and water-clean solder joints were subjected to thermal cycling in order to induce thermal fatigue failure. QFPs failed from a m
Publikováno v:
Journal of Electronic Packaging. 116:83-88
Leadless chip resistors (LCR) made by two different manufacturers and surface mounted on glass/epoxy printed circuit board (PCB) were subjected to thermal cycling between −55°C to 125°C in order to induce thermal fatigue failure/damage. The test