Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Y. S. Upadhyaya"'
Publikováno v:
Advanced Science Letters. 23:1914-1916
Material damage caused by distributed microscopic voids is an important topic for wide variety of engineering problems. The evolution of these distributed microscopic voids and their effects on the mechanical behaviour of materials have been studied
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::377b3b3eb445db4f3d52de8da0df5f58
https://doi.org/10.1166/asl.2017.8538
https://doi.org/10.1166/asl.2017.8538
Publikováno v:
International Journal of Automotive and Mechanical Engineering; Vol 15 No 2 (2018): June 2018
Damage value of two materials SAE 4340 steel and 5A02 aluminium alloy was estimated using Gurson-Tvergaard-Needleman (GTN) model and Bhattacharya- Ellingwood model. Damage prediction using the GTN model demands for value of porosity which can be obta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a25d21c82110eb831f3f421fbc1b0f98
https://igi.indrastra.com/items/show/16058
https://igi.indrastra.com/items/show/16058
Publikováno v:
International Journal of Research in Engineering and Technology. :642-648
Due to the inherent nature of combustion in the Cylinder of a Conventional Internal combustion engine, stress variation as well as a certain temperature distribution sets up in the entire piston. Analysis of piston is required because of its shape an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7910b030bc317649e50f71cdc66fa9b2
https://doi.org/10.15623/ijret.2014.0306119
https://doi.org/10.15623/ijret.2014.0306119
Publikováno v:
Prabandhan: Indian Journal of Management. 12:20
India is one of the leading producer, processor and exporter of the cashews in the world. Cashew processing units are primarily Small and Medium Enterprises(SMEs) and are highly labor intensive.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::274495b323f8cbd39b5dd91c84a5ee12
https://doi.org/10.17010/pijom/2019/v12i6/144933
https://doi.org/10.17010/pijom/2019/v12i6/144933
Autor:
Subraya Krishna Bhat, Raghavendra Deshpande, Sudarshan Hegde, Peter Beck, Chandan Kumar Ghosh, Y. S. Upadhyaya
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
Electronic components are soldered on to a Printed Circuit Board (PCB) to form an electronic assembly. Earlier all solders contained Lead (Pb), but environmental concerns with Pb have paved the way for development of lead-free solders to replace the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8d1a3424cc17523f4ca7a052ec1bcadf
https://doi.org/10.1109/icep.2016.7486886
https://doi.org/10.1109/icep.2016.7486886