Zobrazeno 1 - 10
of 37
pro vyhledávání: '"Y. Ohzeki"'
Autor:
Y. Ohzeki
Publikováno v:
Geographical Review of Japan. 80:460-462
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f9219ac104f6c2e7d3e91383ec514618
https://doi.org/10.4157/grj.80.460
https://doi.org/10.4157/grj.80.460
Publikováno v:
Opportunistic Pathogens. 9:21-25
A new specific serodiagnosis system for Lyme disease was developed using the highly specific partial peptide of outer surface protein C of Borrelia burgdorferi. Finally three peptides (OspC-I, -II and -III) were selected from the outer surface protei
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d6675c412e87d1324f4dbb66415f5567
https://doi.org/10.1016/s1386-2618(97)00003-2
https://doi.org/10.1016/s1386-2618(97)00003-2
Publikováno v:
1992 Proceedings 42nd Electronic Components & Technology Conference.
It is found by studying the factors governing the loop profile in Au bonding wires that the thermal history in forming the ball caused the observed V-shaped hardness distribution in the heat affected zone. It is proved by combining calculation and si
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e511e385aa7baf2f0d15a0f045d1df33
https://doi.org/10.1109/ectc.1992.204313
https://doi.org/10.1109/ectc.1992.204313
Publikováno v:
1991 Proceedings 41st Electronic Components & Technology Conference.
The development of a 40- mu m pitch wire bonding technology for use in development of a 600 DPI LED print head is discussed. To accomplish this, a high-strength super-fine Au-base wire with a diameter of 10 mu m was developed, and a suitable wire bon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c46e2981945e6a081ccec37f2cacace
https://doi.org/10.1109/ectc.1991.163926
https://doi.org/10.1109/ectc.1991.163926
Publikováno v:
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
Micro-ball bump technology has been developed for flip chip (FC) interconnections. This technology is based on (1) a production method of fine metal balls (micro-balls) and (2) a gang-bonding method for forming bumps (micro-ball bumps) on chip electr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5ccc81e1e9ce9a372b34a1802aedb02
https://doi.org/10.1109/ectc.1998.678939
https://doi.org/10.1109/ectc.1998.678939
Publikováno v:
Kansenshogaku zasshi. The Journal of the Japanese Association for Infectious Diseases. 68(1)
A newly described Vibrio cholerae O139 was isolated from a patient who had traveled in India on April 1993. The patient experienced 5 to 6 watery diarrhea per day after he returned to Japan. The isolated strain registered as K111 did not agglutinate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::6640bd4b53aa0ec7629480f52d0ad930
https://pubmed.ncbi.nlm.nih.gov/8138681
https://pubmed.ncbi.nlm.nih.gov/8138681
Publikováno v:
ASAIO Journal. 48:165
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::58fc63feb7e3e4494696b379f00cea10
https://doi.org/10.1097/00002480-200203000-00161
https://doi.org/10.1097/00002480-200203000-00161
Publikováno v:
ASAIO Journal. 48:164
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::02fc4f738eda3c823a40cc2796bcda7d
https://doi.org/10.1097/00002480-200203000-00159
https://doi.org/10.1097/00002480-200203000-00159
Publikováno v:
Nippon Daicho Komonbyo Gakkai Zasshi. 23:48-49,87
To prevent the prolapse of the mucous membrane, more skin should be left than that in the past. The anus is sufficiently pulled out ; and as it is thick, a pair of forceps are applied deep and resection performed, leaving a margin to suture. Because
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad96913281366d94611898a2a7861db2
https://doi.org/10.3862/jcoloproctology.23.48
https://doi.org/10.3862/jcoloproctology.23.48
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