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pro vyhledávání: '"Y. Ohoka"'
Akademický článek
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Autor:
L. M. Butler, O. Pabst, J. Huehn, B. Wahl, K. Aalto, T. Amagai, K. Kunizawa, H. Kagechika, A. Blaschitz, D. M. Otte, W. Maier, T. Glant, M. H. Jang, T. Kobezda, T. Higuchi, N. Hayasaka, S. I. Hammerschmidt, N. Higashi, A. Angyal, J. Alferink, A. Yokota, U. Syrbe, O. Yoshie, P. Knolle, Y. Fu, L. Nikitina, M. Itoi, E. Fusaoka-Nishioka, E. Umemoto, G. E. Rainger, K. Mori, M. Nishimura, E. Kivi, C. Egelston, B. Schürmann, B. Szilagyi, M. Schimek, B. Nuernberg, S. Jin, M. Hashizume, Y. Nishimura, Y. Ohoka, K. Poppensieker, S. N. Syed, E. Kremmer, T. Kinashi, M. Koyama, J. Keuschnigg, K. Shimano, Noah J. Tubo, M. Mihara, S. Song, S. Jalkanen, H. Yagi, H. C. Jeffery, M. Zhu, M. Nakajima, L. Birnbaumer, M. Maksimow, H. Takeuchi, D. D. Le, P. Dresing, R. Kannagi, N. Sato, A. Waisman, M. Prinz, T. Henttinen, G. B. Nash, T. Salminen, T. Sugita, M. Masutani, James Campbell, M. F. Schroeter, T. Tanaka, K. Hieshima, Y. Nymalm, J. Hecht, T. Imai, K. Elima, M. Salmi, A. Mildner, Y. Higuchi, M. Ahrendt, Y. Wang, I. Förster, A. Zimmer, R. Yamaoka, T. Kubo, S. Scheu, C. Kato, A. Limmer, Y. Maeda, H. M. McGettrick, M. Iwata, A. Menning, C. D. Buckley, R. P. Piekorz, K. Chiba, J. E. Gessner, U. Bode, H. Ahammer, K. Tateishi, A. Filer, K. Mikecz, B. A. Ratsch, R. Förster, S. Ichimiya, A. K. Shirakawa, A. Fukunari, M. Pink, L. Klotz, M. Miyasaka, S. R. Ali, K. Sugahara, T. Katakai, R. E. Schmidt, G. Dohr, T. Nakayama, K. Wiege, P. Crocker, Y. Endo, N. Hogg, R. L. Wheat, D. J. Blackbourn, T. Irimura, Y. Uchiyama, A. Shigeta, A. Hamann, S. Floess, M. Sue, P. Sedlmayr, N. Tsukamoto, K. Katagiri, H. Elovaara, S. Yonekura, A. Kyusai
Publikováno v:
International Immunology. 22:ii61-ii66
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af0a04b8f1b4e4bb64cf9854eff543cb
https://doi.org/10.1093/intimm/dxq115
https://doi.org/10.1093/intimm/dxq115
Publikováno v:
Spectrochimica Acta Part B: Atomic Spectroscopy. 53:123-129
A quadrupole-based laser ionization mass spectrometry system was developed by combining a commercial quadrupole mass filter with a laser microprobe instrument, which employs a pulse generator that synchronizes the laser pulse with the quadrupole mass
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28bb54ecc6a9bc5b59f6fea2adb95c54
https://doi.org/10.1016/s0584-8547(97)00108-0
https://doi.org/10.1016/s0584-8547(97)00108-0
Publikováno v:
The Journal of Immunology. 158:5707-5716
Thymocyte-positive selection involves signaling through TCR and accessory molecules, and the signaling intensity appears to be critical for this event. The specific inhibitor of classical Ca2+-dependent protein kinase C (cPKC), Gö 6976, inhibited po
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f6a4fe08deb01627f577dc816f19230
https://doi.org/10.4049/jimmunol.158.12.5707
https://doi.org/10.4049/jimmunol.158.12.5707
Autor:
Shingo Kadomura, T. Hayashi, R. Kanamura, S. Arakawa, A. Isobayashi, Naoki Komai, Y. Ohoka, Y. Ohba
Publikováno v:
2007 IEEE International Interconnect Technology Conferencee.
A method of integrating high performance and low-cost Cu ultra low-k (ULK) SiOC(k=2.0) hybrid interconnects with SiOC(k=2.65) hard mask structure has been developed. The method combines Cu/ULK interconnects with the self-formed MnOx barrier layer tha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b04eed85420e49ef601326486585fb1c
https://doi.org/10.1109/iitc.2007.382351
https://doi.org/10.1109/iitc.2007.382351
Autor:
S, Yorifuji, Y, Iwatani, S, Kawano, S, Inagaki, H, Sugiyama, N, Matsuura, T, Yamanura, Y, Yamamoto, T, Higashi, M, Horio, Y, Oji, H, Yamaguchi, M, Watanabe, N, Kawaguchi, Y, Ohoka, M, Hirata, M, Ishigami, H, Eguchi, Y, Hamada
Publikováno v:
Rinsho byori. The Japanese journal of clinical pathology. 54(3)
The education system for medical technologists has recently been revolutionized, their educational periods vary from 2 to 9 years, and some already have doctoral degrees. In such a new situation, our faculty thinks that the most important point for n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::7037651ad79f22b48d192c162d5eb1fe
https://pubmed.ncbi.nlm.nih.gov/16637580
https://pubmed.ncbi.nlm.nih.gov/16637580
Autor:
I. Mizuno, Shingo Kadomura, Y. Ohoka, Kazunori Nagahata, Kiyotaka Tabuchi, R. Kanamura, S. Arakawa
Publikováno v:
2006 International Interconnect Technology Conference.
The breakthrough integration of Cu/ultra low-k (ULK) SiOC (k = 2.0) interconnects by using advanced pore-sealing and low-k hard mask (HM, k = 2.65) technologies has been accomplished. A low-k HM (k = 2.65) on a hybrid (PAr/SiOC) structure was success
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8455ffedcadb694de1187c512cccf34d
https://doi.org/10.1109/iitc.2006.1648690
https://doi.org/10.1109/iitc.2006.1648690
Publikováno v:
2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers..
Self-formed MnOx barrier technology has been successfully integrated for 150nm pitch Cu dual-damascene interconnects with PAr/SiOC (k=2.65) hybrid structure. Barrier formation at the interface of Cu and various low-k films with few Si or O was confir
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b8196fc9ddcce2a7d82e2ad060ae882
https://doi.org/10.1109/vlsit.2006.1705243
https://doi.org/10.1109/vlsit.2006.1705243
Autor:
Atsuko Sakata, Akihiro Kajita, Kazunori Nagahata, Hideki Shibata, Y. Kato, H. Kawashima, Akihiro Kojima, Tomio Katata, Takamasa Usui, Kiyotaka Tabuchi, Masaki Yamada, R. Kanamura, Shingo Kadomura, E. Ogawa, Y. Ohoka, T. Hayashi, Hideshi Miyajima
Publikováno v:
Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695).
100 nm half-pitch Cu dual-damascene (DD) interconnects with low-k hybrid (PAE(k2.65)/SiOC(k2.5)/SiC(k3.5)) dielectrics have been successfully integrated for a 65 nm-node high performance embedded DRAM. The hybrid-DD structure was fabricated by applyi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0af1da2e6e6496012ca5d6c88da7430c
https://doi.org/10.1109/iitc.2003.1219697
https://doi.org/10.1109/iitc.2003.1219697
Autor:
Kiyotaka Tabuchi, Hideshi Miyajima, Kazunori Nagahata, T. Usui, A. Kajita, Masanaga Fukasawa, Y. Ohoka, Hideki Shibata, S. Shibuki, M. Muramatsu, Shingo Kadomura, R. Kanamura
Publikováno v:
2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407).
Porous PAE/SiOC(k2.5)/SiC(k3.5) hybrid dual damascene (DD) interconnects have been successfully integrated for a 65 nm-node high performance embedded DRAM. The hybrid DD structure was fabricated by applying a triple hard mask (THM) process-for the fi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0607a8bc23400f79a4ae26a7e9dbc7f1
https://doi.org/10.1109/vlsit.2003.1221109
https://doi.org/10.1109/vlsit.2003.1221109