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Autor:
Jarno Groenesteijn, M.J. de Boer, Henk-Willem Veltkamp, Remco J. Wiegerink, Yiping Zhao, Niels Roelof Tas, Y. L. Janssens, Joost Conrad Lötters
Publikováno v:
Journal of micromechanics and microengineering, 31(4):045013. IOP Publishing Ltd.
Micro-electro-mechanical-systems (MEMS) structures with different in-plane dimensions often need to be released simultaneously from the bulk of the wafer and a single dry etching or wet etching technique cannot fulfill all release requirements. In th