Zobrazeno 1 - 10 of 48 pro vyhledávání: '"Y. El Mansy"'
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Akademický článek
Psychological factors outmatched morphological markers in predicting limitations in activities of daily living and participation in patients with lumbar stenosis
Autor: V. Quack, M. Boecker, C. A. Mueller, V. Mainz, M. Geiger, A. W. Heinemann, M. Betsch, Y. El Mansy
Publikováno v: BMC Musculoskeletal Disorders, Vol 20, Iss 1, Pp 1-9 (2019)
Abstract Background Recent demographic changes have led to a large population of older adults, many of whom experience degenerative disc diseases. Degenerative lumbar spinal stenosis (DLSS) is associated with considerable discomfort and limitations i
Externí odkaz: https://doaj.org/article/73d82edfd3ca4182a8de44629b9acd10
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2
Investigating small-group cognitive engagement in general chemistry learning activities using qualitative content analysis and the ICAP framework
Autor: Jack Barbera, Safaa Y. El-Mansy, Alissa J. Hartig
Publikováno v: Chemistry Education Research and Practice. 23:335-347
The level of students’ engagement during active learning activities conducted in small groups is important to understanding the effectiveness of these activities. The Interactive–Constructive–Active–Passive (ICAP) framework is a way to determ
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::197e7f78f05245d4a12065e0488120d5
https://doi.org/10.1039/d1rp00276g
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3
Minimally versus conventional-invasive transforaminal lumbar interbody fusion in patients with failed back surgery syndrome
Autor: G Madarassy, Markus Tingart, Y. El Mansy, Filippo Migliorini
Publikováno v: MUSCULOSKELETAL SURGERY. 105:297-302
Failed back surgery syndrome is an important cause of back and leg pain after spinal surgery. Transforaminal lumbar interbody fusion (TLIF) is commonly used in revision surgery for failed back surgery syndrome. In the literature, there is a lack of e
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::fe6fd428a5a5dc4c14e629f47a02f323
https://doi.org/10.1007/s12306-020-00659-7
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5
Psychological factors outmatched morphological markers in predicting limitations in activities of daily living and participation in patients with lumbar stenosis
Autor: Christian Andreas Mueller, Valentin Quack, Maren Boecker, Allen W. Heinemann, Y. El Mansy, M. Betsch, Verena Mainz, Matthias Florian Geiger
Publikováno v: BMC Musculoskeletal Disorders, Vol 20, Iss 1, Pp 1-9 (2019)
BMC Musculoskeletal Disorders
BMC musculoskeletal disorders 20, 557 (2019). doi:10.1186/s12891-019-2918-0
BMC musculoskeletal disorders 20, 557 (2019). doi:10.1186/s12891-019-2918-0
Published by BioMed Central, London
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ffe7e31a4ef26868403bc947ed448dcd
http://link.springer.com/article/10.1186/s12891-019-2918-0
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7
Minimally versus conventional-invasive transforaminal lumbar interbody fusion in patients with failed back surgery syndrome
Autor: Y, El Mansy, F, Migliorini, M, Tingart, G, Madarassy
Publikováno v: Musculoskeletal surgery. 105(3)
Failed back surgery syndrome is an important cause of back and leg pain after spinal surgery. Transforaminal lumbar interbody fusion (TLIF) is commonly used in revision surgery for failed back surgery syndrome. In the literature, there is a lack of e
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=pmid________::6f7f505c957809883f34b62d59e6558c
https://pubmed.ncbi.nlm.nih.gov/32319074
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10
A 90-nm logic technology featuring strained-silicon
Autor: Jason Klaus, Kaizad Mistry, C. Kenyon, K. Kuhn, C. Auth, B. Obradovic, S. Tyagi, Tahir Ghani, P. Nguyen, R. Shaheed, B. Tufts, Z. Ma, G. Glass, Scott E. Thompson, Anand Portland Murthy, Chia-Hong Jan, Mohsen Alavi, Y. El-Mansy, Lucian Shifren, Ramune Nagisetty, S. Cea, M. Bohr, R. Chau, T. Hoffman, Swaminathan Sivakumar, Mark Armstrong, B. McIntyre, M. Buehler
Publikováno v: IEEE Transactions on Electron Devices. 51:1790-1797
A leading-edge 90-nm technology with 1.2-nm physical gate oxide, 45-nm gate length, strained silicon, NiSi, seven layers of Cu interconnects, and low-/spl kappa/ CDO for high-performance dense logic is presented. Strained silicon is used to increase
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::abd5c7b6f32f4c7bcb8ee42eace7b80c
https://doi.org/10.1109/ted.2004.836648
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