Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Y. C. How"'
Publikováno v:
Computers and Geotechnics. 28:161-184
This paper presents the Ritz method for the settlement analysis of rectangular thick rafts resting on a homogeneous, elastic half-space. As the considered raft is thick, the Mindlin plate theory has to be used to model the raft in order to allow for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::418a34038711a4d1e8d0d24deb25071d
https://doi.org/10.1016/s0266-352x(00)00030-6
https://doi.org/10.1016/s0266-352x(00)00030-6
Autor:
A. Prabhu, Y. C. How, S. Qu, S. Athavale, Luu T. Nguyen, C. S. Lee, A. Xu, K. C. Ooi, A. Poddar
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Electrolytic CuNiAu over pad metallization (OPM) was qualified for high temperature gold wire bonding applications. Stability of the CuNiAu OPM metal stack was tested through extreme conditions, i.e.: ambient temperature 250 °C up to 4000 hours, wit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4957859ede57e772921926e51ef9c3e1
https://doi.org/10.1109/ectc.2011.5898708
https://doi.org/10.1109/ectc.2011.5898708
Autor:
S. Qu, S. Athavale, Y. C. How, A. Xu, A. Prabhu, K. C. Ooi, Ken Pham, C. S. Lee, Luu T. Nguyen, A. Poddar
Publikováno v:
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).
Electrolessly plated over pad metallization (OPM) was evaluated for high temperature gold wire bonding applications. Bonding strength, measured by wire bond bump shear test, of 4N gold wire on electroless OPMs, such as electroless nickel/immersion go
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aec2634058575a6c7577bd3077569526
https://doi.org/10.1109/iemt.2010.5746709
https://doi.org/10.1109/iemt.2010.5746709