Zobrazeno 1 - 10
of 159
pro vyhledávání: '"Y Ohoka"'
Autor:
L. M. Butler, O. Pabst, J. Huehn, B. Wahl, K. Aalto, T. Amagai, K. Kunizawa, H. Kagechika, A. Blaschitz, D. M. Otte, W. Maier, T. Glant, M. H. Jang, T. Kobezda, T. Higuchi, N. Hayasaka, S. I. Hammerschmidt, N. Higashi, A. Angyal, J. Alferink, A. Yokota, U. Syrbe, O. Yoshie, P. Knolle, Y. Fu, L. Nikitina, M. Itoi, E. Fusaoka-Nishioka, E. Umemoto, G. E. Rainger, K. Mori, M. Nishimura, E. Kivi, C. Egelston, B. Schürmann, B. Szilagyi, M. Schimek, B. Nuernberg, S. Jin, M. Hashizume, Y. Nishimura, Y. Ohoka, K. Poppensieker, S. N. Syed, E. Kremmer, T. Kinashi, M. Koyama, J. Keuschnigg, K. Shimano, Noah J. Tubo, M. Mihara, S. Song, S. Jalkanen, H. Yagi, H. C. Jeffery, M. Zhu, M. Nakajima, L. Birnbaumer, M. Maksimow, H. Takeuchi, D. D. Le, P. Dresing, R. Kannagi, N. Sato, A. Waisman, M. Prinz, T. Henttinen, G. B. Nash, T. Salminen, T. Sugita, M. Masutani, James Campbell, M. F. Schroeter, T. Tanaka, K. Hieshima, Y. Nymalm, J. Hecht, T. Imai, K. Elima, M. Salmi, A. Mildner, Y. Higuchi, M. Ahrendt, Y. Wang, I. Förster, A. Zimmer, R. Yamaoka, T. Kubo, S. Scheu, C. Kato, A. Limmer, Y. Maeda, H. M. McGettrick, M. Iwata, A. Menning, C. D. Buckley, R. P. Piekorz, K. Chiba, J. E. Gessner, U. Bode, H. Ahammer, K. Tateishi, A. Filer, K. Mikecz, B. A. Ratsch, R. Förster, S. Ichimiya, A. K. Shirakawa, A. Fukunari, M. Pink, L. Klotz, M. Miyasaka, S. R. Ali, K. Sugahara, T. Katakai, R. E. Schmidt, G. Dohr, T. Nakayama, K. Wiege, P. Crocker, Y. Endo, N. Hogg, R. L. Wheat, D. J. Blackbourn, T. Irimura, Y. Uchiyama, A. Shigeta, A. Hamann, S. Floess, M. Sue, P. Sedlmayr, N. Tsukamoto, K. Katagiri, H. Elovaara, S. Yonekura, A. Kyusai
Publikováno v:
International Immunology. 22:ii61-ii66
Publikováno v:
Spectrochimica Acta Part B: Atomic Spectroscopy. 53:123-129
A quadrupole-based laser ionization mass spectrometry system was developed by combining a commercial quadrupole mass filter with a laser microprobe instrument, which employs a pulse generator that synchronizes the laser pulse with the quadrupole mass
Publikováno v:
The Journal of Immunology. 158:5707-5716
Thymocyte-positive selection involves signaling through TCR and accessory molecules, and the signaling intensity appears to be critical for this event. The specific inhibitor of classical Ca2+-dependent protein kinase C (cPKC), Gö 6976, inhibited po
Autor:
Shingo Kadomura, T. Hayashi, R. Kanamura, S. Arakawa, A. Isobayashi, Naoki Komai, Y. Ohoka, Y. Ohba
Publikováno v:
2007 IEEE International Interconnect Technology Conferencee.
A method of integrating high performance and low-cost Cu ultra low-k (ULK) SiOC(k=2.0) hybrid interconnects with SiOC(k=2.65) hard mask structure has been developed. The method combines Cu/ULK interconnects with the self-formed MnOx barrier layer tha
Autor:
S, Yorifuji, Y, Iwatani, S, Kawano, S, Inagaki, H, Sugiyama, N, Matsuura, T, Yamanura, Y, Yamamoto, T, Higashi, M, Horio, Y, Oji, H, Yamaguchi, M, Watanabe, N, Kawaguchi, Y, Ohoka, M, Hirata, M, Ishigami, H, Eguchi, Y, Hamada
Publikováno v:
Rinsho byori. The Japanese journal of clinical pathology. 54(3)
The education system for medical technologists has recently been revolutionized, their educational periods vary from 2 to 9 years, and some already have doctoral degrees. In such a new situation, our faculty thinks that the most important point for n
Autor:
I. Mizuno, Shingo Kadomura, Y. Ohoka, Kazunori Nagahata, Kiyotaka Tabuchi, R. Kanamura, S. Arakawa
Publikováno v:
2006 International Interconnect Technology Conference.
The breakthrough integration of Cu/ultra low-k (ULK) SiOC (k = 2.0) interconnects by using advanced pore-sealing and low-k hard mask (HM, k = 2.65) technologies has been accomplished. A low-k HM (k = 2.65) on a hybrid (PAr/SiOC) structure was success
Publikováno v:
2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers..
Self-formed MnOx barrier technology has been successfully integrated for 150nm pitch Cu dual-damascene interconnects with PAr/SiOC (k=2.65) hybrid structure. Barrier formation at the interface of Cu and various low-k films with few Si or O was confir
Autor:
Atsuko Sakata, Akihiro Kajita, Kazunori Nagahata, Hideki Shibata, Y. Kato, H. Kawashima, Akihiro Kojima, Tomio Katata, Takamasa Usui, Kiyotaka Tabuchi, Masaki Yamada, R. Kanamura, Shingo Kadomura, E. Ogawa, Y. Ohoka, T. Hayashi, Hideshi Miyajima
Publikováno v:
Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695).
100 nm half-pitch Cu dual-damascene (DD) interconnects with low-k hybrid (PAE(k2.65)/SiOC(k2.5)/SiC(k3.5)) dielectrics have been successfully integrated for a 65 nm-node high performance embedded DRAM. The hybrid-DD structure was fabricated by applyi
Autor:
Kiyotaka Tabuchi, Hideshi Miyajima, Kazunori Nagahata, T. Usui, A. Kajita, Masanaga Fukasawa, Y. Ohoka, Hideki Shibata, S. Shibuki, M. Muramatsu, Shingo Kadomura, R. Kanamura
Publikováno v:
2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407).
Porous PAE/SiOC(k2.5)/SiC(k3.5) hybrid dual damascene (DD) interconnects have been successfully integrated for a 65 nm-node high performance embedded DRAM. The hybrid DD structure was fabricated by applying a triple hard mask (THM) process-for the fi
Autor:
Masao Ishihara, Hiizu Ohtorii, Zenya Yasuda, Takeshi Nogami, Shuzo Sato, Yuji Segawa, Kaori Tai, Y. Ohoka, Shingo Takahashi, Hiroshi Horikoshi, Naoki Komai
Publikováno v:
Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).
A PVD-Ta/CVD-WN stacked barrier structure has been newly developed. Its PVD-Ta layer and CVD-WN layer work complementarily. Its conformal CVD-WN layer provides an excellent barrier performance and helps the overlying Cu seed suitable for Cu filling.