Zobrazeno 1 - 10
of 90
pro vyhledávání: '"Xueren Zhang"'
Publikováno v:
Medical Physics.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::013d0010a048cdf96c475ecac12fa3a7
https://doi.org/10.1002/mp.16277
https://doi.org/10.1002/mp.16277
Publikováno v:
Stata Journal; Sep2023, Vol. 23 Issue 3, p730-753, 24p
Autor:
Xueren Zhang1 zhijunzhang_hi@163.com, Yuliang Zhao2 zhaoyl0018@163.com, Rangkun Qi2 rangkun@126.com, Usman, Muhammad3 usmanzuel@yahoo.com
Publikováno v:
Transformations in Business & Economics. 2019, Vol. 18 Issue 2B, p900-920. 21p. 9 Charts.
Publikováno v:
2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA).
Flip chip ball grid array (FCBGA) packages is becoming more attractive for automotive applications driven by the high performance requirement. Stacked vias are widely used in FCBGA substrate due to higher routing request. The reliability of stacked v
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::892cba642372c6f5bdc4460a1c8a65ea
https://doi.org/10.1109/ipfa47161.2019.8984818
https://doi.org/10.1109/ipfa47161.2019.8984818
Publikováno v:
Journal of Physics: Conference Series. 1325:012219
This paper introduces a design of ultra-low phase noise frequency source based on high phase detection frequency. Frequency source is a very important part of modern electronic system. Radar, communication, space technology and so on are inseparable
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85e9ddd7064e638ce119a912c6e44cef
https://doi.org/10.1088/1742-6596/1325/1/012219
https://doi.org/10.1088/1742-6596/1325/1/012219
Autor:
Matteo Tremolada, Olivier Kermarrec, Mark Andrew Shaw, Xueren Zhang, Fabio Pietro Fiabane, Roberto Curti, Massimo Fere, Livio Gobbato, Carine Besset
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Recent progress made in Silicon Photonics building blocks has paved the way for large scale industrialisation of devices that can be fabricated in existing CMOS fabs, and recently important steps have also been taken on the industrialisation on 12″
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af68c8cb46287a27a29b80c55cda1f75
https://doi.org/10.1109/eptc.2016.7861446
https://doi.org/10.1109/eptc.2016.7861446
Publikováno v:
Science in China Series D: Earth Sciences. 50:86-96
A structural mode was used to characterize vegetation composition at the plant leaf level and a flourishing-withering ratio was developed. The spectral responses of vegetation with different flourishing-withering ratios were analyzed, the change rate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a256df041eef6bed3d5cf8f26546ade4
https://doi.org/10.1007/s11430-007-5001-x
https://doi.org/10.1007/s11430-007-5001-x
Publikováno v:
Journal of Electronic Materials. 36:110-116
Interfacial delamination is a common failure mode in multilayered IC packages. In this paper, an experimental technique using Brazil-nut specimens is employed to determine the interfacial fracture toughness of an adhesively sandwiched joint with the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b7c7a16a54010912c558b1457ce35e2
https://doi.org/10.1007/s11664-006-0065-5
https://doi.org/10.1007/s11664-006-0065-5
Autor:
Xueren Zhang, Tong Yan Tee
Publikováno v:
Thin Solid Films. 504:355-361
A study of the Au/Al intermetallics compound (IMC) in gold wire bonds on aluminum pads is presented. A test vehicle has been deliberately built for high temperature storage (HTS) test. There are two kinds of samples, i.e., one is with uniform interme
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b087cde18c6688ff3b60fe224dbd1a1
https://doi.org/10.1016/j.tsf.2005.09.121
https://doi.org/10.1016/j.tsf.2005.09.121
Publikováno v:
IEEE Transactions on Advanced Packaging. 29:232-239
A comprehensive warpage analysis is performed on the matrix stacked-die ball grid array BGA (SDBGA) by means of finite-element modeling and experimental warpage measurements. By comparing the block warpage results from conventional linear small defor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a970b46300a5575cd5df68974bdc632
https://doi.org/10.1109/tadvp.2006.871191
https://doi.org/10.1109/tadvp.2006.871191