Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Xueping Ru"'
Autor:
Xueping Ru, Andrew Bakir, Michael Kotelyanskii, Jonathan Cohen, Manjusha Mehendale, Michelle T. Schulberg, Priya Mukundhan, Robin Mair, David M. Stobbe, Todd W. Murray, T. Kryman
Publikováno v:
International Symposium on Microelectronics. 2015:000486-000492
The drive to reduce the interconnect pitch and increase the number of connections for packaging in mobile devices has led to the development of copper pillar bumps. The key drivers for the adoption of copper pillars are improved performance, reduced
Autor:
Xueping Ru, J.R. Dorroh
Publikováno v:
Journal of Mathematical Analysis and Applications. 236(2):503-519
Autor:
Murray, Todd W., Bakir, Andrew, Stobbe, David M., Kotelyanskii, Michael J., Mair, Robin A., Mehendale, Manjusha, Xueping Ru, Cohen, Jonathan D., Schulberg, Michelle T., Mukundhan, Priya, Kryman, Timothy J.
Publikováno v:
Journal of Microelectronic & Electronic Packaging; 2016 2nd Quarter, Vol. 13 Issue 2, p58-63, 6p