Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Xueni Ding"'
Publikováno v:
IEEE Access, Vol 6, Pp 67108-67117 (2018)
Power electronics are widely used in energy conversion systems due to their high efficiency. Finding and replacing the defective power electronic modules timely by monitoring the ageing state of devices can greatly improve the security of power conve
Externí odkaz:
https://doaj.org/article/bee27427efe14003a7a61210b605a5dd
Autor:
Haijian Zhi, Tao Wang, Hongyun Zhang, Kai Li, Ting Hu, Puwen Song, Zhai Rui, Xueni Ding, Gao Le, Kai Zhang, Jinyan Luo
Publikováno v:
Molecular Plant Pathology
Soybean mosaic virus (SMV), a potyvirus, is the most prevalent and destructive viral pathogen in soybean‐planting regions of China. Moreover, other potyviruses, including bean common mosaic virus (BCMV) and watermelon mosaic virus (WMV), also threa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::92e46c1dafc335b8c126e6786fc92bfc
https://doi.org/10.1111/mpp.12897
https://doi.org/10.1111/mpp.12897
Publikováno v:
2019 4th International Conference on Intelligent Green Building and Smart Grid (IGBSG).
With the high speed extend of the wind turbine generation, lifetime estimation model for the core components in wind turbine converter is important for design and maintenance. Several lifetime models were proposed, which consider the long term effect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3a07c11502c7ad33906abdc5b476df8
https://doi.org/10.1109/igbsg.2019.8886209
https://doi.org/10.1109/igbsg.2019.8886209
Publikováno v:
Electronics
Volume 10
Issue 2
Electronics, Vol 10, Iss 194, p 194 (2021)
Volume 10
Issue 2
Electronics, Vol 10, Iss 194, p 194 (2021)
Bond wire lift-off will cause an increase of remaining wires&rsquo
power dissipation, which usually is ignored for healthy modules. However, only partial wires&rsquo
power dissipation transfers through thermal path from junction to case, wh
power dissipation, which usually is ignored for healthy modules. However, only partial wires&rsquo
power dissipation transfers through thermal path from junction to case, wh
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dc6b6d0fc120927c5733e7be1837e964
https://doi.org/10.3390/electronics10020194
https://doi.org/10.3390/electronics10020194