Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Xue Chuan Shan"'
Publikováno v:
Journal of The Surface Finishing Society of Japan. 54:655-659
Publikováno v:
SPIE Proceedings.
High-temperature and high-pressure connection between micro combustor and macro world for feeding of air/fuel gas is required in PowerMEMS development. A Kovar tubing-Glass-Si sealing process has been developed for an on-going PowerMEMS project to co
Publikováno v:
SPIE Proceedings.
This paper reports on design, fabrication and characterisation of a MEMS-based micro combustor for micro power generation systems. The first micro combustor implemented was a static gas turbine engine. The micro combustor was composed of seven silico
Publikováno v:
SPIE Proceedings.
As part of an effort to develop MEMS-based power generation system, an assembly solution for combustion test of a recent-developed micro combustion device micromachined from single crystal silicon were proposed. In order to supply hydrogen/air to inl
Publikováno v:
Advances in Electronic Packaging, Parts A, B, and C.
A 2D optical switch system using two ball lenses as a collimator was theoretically analyzed with the objective of minimizing optical insertion loss. The lens diameters, lens material, path length, and alignment tolerance were optimized for use with s
Publikováno v:
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003..
Development of low cost manufacturing processes for the MEMS and the MOEMS is important for their commercialization. A micro hot embossing process is used to make optical and Bio devices with Polycarbonate (PC) and Polymethylmetacrylate (PMMA) materi
Micro hot embossing for high-aspect-ratio structure with materials flow enhancement by polymer sheet
Publikováno v:
SPIE Proceedings.
Nano imprinting or Nano embossing process have been introduced to fabricate semiconductor, optical device and Micro Electro Mechanical Systems (MEMS) and the Nano Electro Mechanical Systems (NEMS) to reduce the fabrication cost. In our previous paper
Autor:
Weremczuk, J., Plotczyk, K., Tarapata, G., Jachowicz, R., Xue Chuan Shan, Shi, C.W.P., Hon Tat Hui
Publikováno v:
2009 IEEE Instrumentation & Measurement Technology Conference; 2009, p1290-1293, 4p
Publikováno v:
Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS 2003; 2003, p304-311, 8p