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pro vyhledávání: '"Xuankai Zhou"'
Publikováno v:
Micromachines, Vol 15, Iss 3, p 418 (2024)
With the advancement of micro- and nanomanufacturing technologies, electronic components and chips are increasingly being miniaturized. To automatically identify their packaging materials for ensuring the reliability of ICs, a hybrid deep learning fr
Externí odkaz:
https://doaj.org/article/639ac1c2f5ad4e5b976e0bd23ab5092d