Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Xuanchen Wei"'
Autor:
Yong-Chun Huang, Wan-Ling Zhong, Xuanchen Wei, Xiu-Kui Bai, Xiao-Ming Liu, Gang-Sheng Zhang, Cai-Xia Lei
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:21742-21755
In this work, the spherical TiO2 inverse opal photonic crystals (IOPCs) have been successfully prepared through the combination of sol–gel and liquid phase deposition (LPD) method using SiO2 spheres as the templates. The characterization results sh
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0c01f6f8672e1034c56ee096abeb349
https://doi.org/10.1007/s10854-021-06694-9
https://doi.org/10.1007/s10854-021-06694-9
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:14035-14046
In this study, Sn-0.7Cu composite solders with different weight of graphene nanosheets (GNSs) were successfully prepared by mechanical milling and hot-pressing sintering. The effects of GNSs on the microstructure, wettability, and mechanical properti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::352741820616a06b3d3af0b6864e0da5
https://doi.org/10.1007/s10854-020-03920-8
https://doi.org/10.1007/s10854-020-03920-8
Autor:
Yitai Li, Yongzhong Zhan, Qiang Li, Zaixiang Du, Junli Feng, Shuyuan Yu, Xuanchen Wei, Wenchao Yang
Publikováno v:
Materials
Volume 12
Issue 22
Volume 12
Issue 22
Sn-0.7Cu-0.075Al solder alloy adding with Ce and La had been successfully prepared by applying ball-milling and vacuum arc remelting. The influence of Ce and La on microstructure and corrosion behavior of Sn-0.7Cu-0.075Al solder alloy was investigate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::db25f2cff7c7f4301daade2f14c98f0d