Zobrazeno 1 - 10
of 109
pro vyhledávání: '"Xuan-Tu Tran"'
Publikováno v:
IEEE Access, Vol 11, Pp 82377-82389 (2023)
Spiking Neural Networks (SNNs) show their potential for lightweight low-power inferences because they mimic the functionality of the biological brain. However, one of the major challenges of SNNs like other neural networks is memory-wall and power-wa
Externí odkaz:
https://doaj.org/article/5efaebcb51b04635b827e657fe04efc2
Autor:
Mohammed Al-Shatari, Fawnizu Azmadi Hussin, Azrina Abd Aziz, Taiseer Abdalla Elfadil Eisa, Xuan-Tu Tran, Mhassen Elnour Elneel Dalam
Publikováno v:
Applied Sciences, Vol 13, Iss 18, p 10345 (2023)
IoT devices and embedded systems are deployed in critical environments, emphasizing attributes like power efficiency and computational capabilities. However, these constraints stress the paramount importance of device security, stimulating the explor
Externí odkaz:
https://doaj.org/article/6e2fa5f11a9f45e5a942afc62a62ad58
Publikováno v:
IET Microwaves, Antennas & Propagation, Vol 15, Iss 5, Pp 474-480 (2021)
Abstract The authors present a novel wideband two‐dimensional voltage‐controlled attenuator (VCA). The proposed design employs both stacked‐FET configuration and distributed structure to achieve wideband performance, high power, and high dynami
Externí odkaz:
https://doaj.org/article/56f6d120fe0f4e1d9e965b4ee867c7e1
Publikováno v:
IEEE Access, Vol 8, Pp 59571-59589 (2020)
As one of the most promising technologies to realize 3D Integrated Circuits (3D-ICs), Through-Silicon-Via (TSV) acts as the inter-layer link inside 3D Networks-on-Chip. However, the reliability issues due to the low yield rates and the sensitivity to
Externí odkaz:
https://doaj.org/article/2bfac10907d04ccda55a8c8c4cfca046
Publikováno v:
IEEE Access, Vol 8, Pp 166642-166657 (2020)
Through-Silicon-Via (TSV) based 3D Integrated Circuits (3D-IC) are one of the most advanced architectures by providing low power consumption, shorter wire length and smaller footprint. However, 3D-ICs confront lifetime reliability due to high operati
Externí odkaz:
https://doaj.org/article/f3682c1c3eb24acfbcfeac489780c887
Autor:
Mohammed Omar Awadh Al-Shatari, Fawnizu Azmadi Hussin, Azrina Abd Aziz, Gunawan Witjaksono, Xuan-Tu Tran
Publikováno v:
IEEE Access, Vol 8, Pp 207610-207618 (2020)
The design of cryptographic engines for the Internet of Things (IoT) edge devices and other ultralightweight devices is a crucial challenge. The emergence of such resource-constrained devices raises significant challenges to current cryptographic alg
Externí odkaz:
https://doaj.org/article/a75420b62be746a0ba2c0a12b412a5fa
Publikováno v:
EAI Endorsed Transactions on Industrial Networks and Intelligent Systems, Vol 7, Iss 22 (2020)
In image compression and video coding, quantization error helps to reduce the amount of information ofthe high frequency components. However, in temporal prediction the quantization error contributes its valueas noise in the total residual informatio
Externí odkaz:
https://doaj.org/article/a9467b7c1c0f46669452e514fb68519d
Publikováno v:
Journal of Low Power Electronics and Applications, Vol 11, Iss 2, p 23 (2021)
Deep Learning (DL) has contributed to the success of many applications in recent years. The applications range from simple ones such as recognizing tiny images or simple speech patterns to ones with a high level of complexity such as playing the game
Externí odkaz:
https://doaj.org/article/bc273432f2f74584b5474b81022d6db9
Autor:
Hung K. Nguyen, Xuan-Tu Tran
Publikováno v:
ACM Transactions on Parallel Computing. 9:1-23
This article proposes and implements a Coarse-grained dynamically Reconfigurable Architecture, named Reconfigurable Multimedia Accelerator (REMAC). REMAC architecture is driven by the pipelined multi-instruction-multi-data execution model for exploit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28f6a706b882f8b5c852380531202f53
https://doi.org/10.1145/3543544
https://doi.org/10.1145/3543544
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 41:799-812
Through Silicon Via (TSV) is considered as the near-future solution to realize low-power and high-performance 3D-Integrated Circuits (3D-ICs) and 3D-Network-on-Chips (3D-NoCs). However, the lifetime reliability issue of TSV due to its fault sensitivi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a4f9f146cf1f67cda1e3f8dbdb17a18
https://doi.org/10.1109/tcad.2021.3069370
https://doi.org/10.1109/tcad.2021.3069370