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Autor:
Angela Teo, Ng Hui Peng, N. Dayanand, Tam Yong Seng, J.C. Lam, Mai Zhi Hong, Xu Nai Yun, Chen Chang Qing, Ang Ghim Boon
Publikováno v:
2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
In wafer fabrication, it is important for analyst to be equipped with the mindset of deep dive towards uncovering the underlying “hidden and real” defect even after finding some anomaly that appears to be the root cause. This is critical as inexp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5c72a54c30bfc1da8db6c2749a3dba8
https://doi.org/10.1109/ipfa.2017.8060215
https://doi.org/10.1109/ipfa.2017.8060215
