Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Xizhi Su"'
Publikováno v:
SIAM Journal on Financial Mathematics; 2024, Vol. 15 Issue 2, p360-398, 39p
Publikováno v:
SSRN Electronic Journal.
Technology advances have enhanced competition in insurance industry. This paper investigates a class of dynamic asset and liability management(ALM) game among mean-variance insurers with relative log return performance. We obtain the unique explicit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6986427dfe728ab367921fd9c0151c23
https://doi.org/10.2139/ssrn.3888113
https://doi.org/10.2139/ssrn.3888113
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::44e48704b2ce7a1ab7c508ee992a748a
https://doi.org/10.2139/ssrn.3973861
https://doi.org/10.2139/ssrn.3973861
Publikováno v:
SSRN Electronic Journal.
We consider a market where most profit-relevant factors (e.g., storage costs and selling expenses) are negligible, and the trade-off between price and volume is the only concern. We investigate the optimal discrete-time pricing strategy of a monopoli
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e10aeb457d8b7dfd8398a221a527df55
https://doi.org/10.2139/ssrn.3530925
https://doi.org/10.2139/ssrn.3530925
Autor:
Xizhi Su, Quanyuan Feng
Publikováno v:
2011 International Conference on Advanced Power System Automation and Protection.
Double-Epilayer structure were studied for n-channel low-voltage power trench MOSFET,The total specific on-resistance (Rds,on) of U-MOSFET can be reduced by optimizing the Double-Epilayer structure, Let's elect better intrinsic epitaxial layer thickn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0d8f79d7f2c4516794c666487344d5f
https://doi.org/10.1109/apap.2011.6180839
https://doi.org/10.1109/apap.2011.6180839
Publikováno v:
Machines, Vol 10, Iss 12, p 1237 (2022)
A high vacuum environment safeguards the performance of special processing technologies and high-precision parts such as nanosecond laser processing, chip packaging, and optical components. However, it poses higher requirements for the machine tool,
Externí odkaz:
https://doaj.org/article/62eac7b4463a4795b2cfbbea32828c37