Zobrazeno 1 - 10
of 26
pro vyhledávání: '"Xiuyang Shan"'
Autor:
Lifeng Zhang, Mengdi Gao, Xiuyang Shan, Qianqian Shen, Hengzheng Li, Qiang Li, Buyuan Guan, Rui Gao
Publikováno v:
Journal of Materials Research and Technology, Vol 31, Iss , Pp 3212-3225 (2024)
CrMnFeCoNi high-entropy alloy (HEA) manufactured by laser powder bed fusion has been demonstrated to possess a superior trade-off of tensile strength and ductility due to unique microstructures during the printed process. However, the improvement of
Externí odkaz:
https://doaj.org/article/d2f187d572d4427596c2fbc732c3f359
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:494-501
Jetting technology has become popular in microelectronic packaging due to its high efficiency and noncontact property. Its performance is significantly affected by the structure design. However, it is very difficult and time-consuming to conduct the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7157c30f726c611938589f03a7922d0
https://doi.org/10.1109/tcpmt.2020.2972016
https://doi.org/10.1109/tcpmt.2020.2972016
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:1300-1306
The jetting technology has become popular in microelectronic packaging owing to its high efficiency and the noncontact property. However, high-speed jetting will generate strong oscillation that will affect the jetting consistency. To improve the jet
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f839eb3aafd6cdd42d6d621ca574c835
https://doi.org/10.1109/tcpmt.2018.2841048
https://doi.org/10.1109/tcpmt.2018.2841048
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:300-309
Jet dispensing has been widely considered as the next generation of dispensing technology. Since there is no online measurement of the droplet volume in the jetting process, the dispensing usually operates in open loop without any online control. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6123e3ac398240c640c0f991f4093c83
https://doi.org/10.1109/tcpmt.2017.2783904
https://doi.org/10.1109/tcpmt.2017.2783904
Autor:
Xiuyang Shan, Yun Chen
Publikováno v:
Microelectronics Reliability. 80:42-46
In electronics packaging manufacturing, the adhesive materials are delivered on the microelectronic products using the dispensing technology. In the dispensing process, the dispensed volume of adhesive will be affected by its viscosity. The adhesive
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d5b5d1467e6730d22c00529d99bcb97
https://doi.org/10.1016/j.microrel.2017.11.011
https://doi.org/10.1016/j.microrel.2017.11.011
Publikováno v:
Ultrasonics Sonochemistry. 28:15-20
Epoxy dispensing is one of the most critical processes in microelectronic packaging. However, due its high viscoelasticity, dispensing of epoxy is extremely difficult, and a lower viscoelasticity epoxy is desired to improve the process. In this paper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::46c2e3cfaa55802a9cfb58ad374f50d8
https://doi.org/10.1016/j.ultsonch.2015.06.026
https://doi.org/10.1016/j.ultsonch.2015.06.026
Autor:
Yun Chen, Xiuyang Shan
Publikováno v:
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
The silicone has been widely used in the LED packaging process and the dispensing method is commonly implemented to deliver the silicone on the LED chip. In the dispensing process, the consistency of droplet volume can make great effects on the quali
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9054c1be5af3b33011efcb359b73fb3e
https://doi.org/10.1109/icept.2017.8046466
https://doi.org/10.1109/icept.2017.8046466
Publikováno v:
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Fluid viscosity varying with fluid temperature is a key factor in influencing the volume consistency of the fluid jet dispensing process. In this paper, the mechanism model of the transient temperature field in jet dispensing valve was developed by a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0667669a618ca86b1a857401cb26a078
https://doi.org/10.1109/icept.2016.7583124
https://doi.org/10.1109/icept.2016.7583124
Publikováno v:
2014 15th International Conference on Electronic Packaging Technology.
In this paper, the model of jet dispensing process is developed by decomposing the dispenser into three parts. This model includes all the important system parameters, such as the fluid viscosity, the diameter and length of nozzle and backflow chambe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::346916670d1cd6ff8e2ae9bddd3e581a
https://doi.org/10.1109/icept.2014.6922653
https://doi.org/10.1109/icept.2014.6922653
Publikováno v:
2014 15th International Conference on Electronic Packaging Technology.
Silicone jet dispensing is the next generation dispensing method for LED packaging. However, as the jet dispensing is a high speed but micro dimensional transient process, the jet dispensing process is difficult to observe and measure, which brings m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3398cf754153719fa9b51675067d0b84
https://doi.org/10.1109/icept.2014.6922924
https://doi.org/10.1109/icept.2014.6922924