Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Xiong, Guoji"'
Autor:
Zhang, Wenqiang, Zhang, Kexin, Ma, Yanhui, Song, Yixin, Qi, Tongbing, Xiong, Guoji, Zhang, Yuanzhu, Kan, Chengxia, Zhang, Jingwen, Han, Fang, Sun, Xiaodong
Publikováno v:
In Biomedicine & Pharmacotherapy October 2023 166
Autor:
Song, Yixin, Ma, Yujie, Zhang, Kexin, Zhang, Wenqiang, Xiong, Guoji, Qi, Tongbing, Shi, Junfeng, Qiu, Hongyan, Zhang, Jingwen, Han, Fang, Kan, Chengxia, Sun, Xiaodong
Publikováno v:
In Biochemical and Biophysical Research Communications August 2023
Akademický článek
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K zobrazení výsledku je třeba se přihlásit.
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Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Huang Chunyue, Li Tianming, Wu Song, Tang Wenliang, Xiong Guoji, Li Chunquan, Ning Zhongping, Liang Ying
Publikováno v:
2014 15th International Conference on Electronic Packaging Technology.
The finite element model of bump bonding is built and loads with conditions of bonding time, bonding pressure and bonding power at the same time, and the stress and strain analysis of the pad will take place using this bump bonding finite element mod
Autor:
Ning Zhong Ping, Li Chunquan, Li Tianming, Xiong Guoji, Liang Ying, Wu Song, Tang Wenliang, Huang Chunyue
Publikováno v:
2014 15th International Conference on Electronic Packaging Technology.
The 3D finite element analysis models of 3D-TSV interconnect structure were developed. By using ANSYS the finite element analysis of the stress and strain distribution in the model was performed under random vibration load. Comparative analysis of th
Publikováno v:
2014 15th International Conference on Electronic Packaging Technology.
The 3D finite element analysis models of lead-free solder joint with compliant layer in wafer level chip scale package (WLCSP) were developed. Based on the models the lead-free solder joint with compliant layer stress and plastic strain were analyzed
Publikováno v:
2013 14th International Conference on Electronic Packaging Technology; 2013, p587-590, 4p