Zobrazeno 1 - 10
of 98
pro vyhledávání: '"Xinhuan Niu"'
Autor:
Jonathan Z. Pan, Zhanqiang Wang, Wei Sun, Peipei Pan, Wei Li, Yongtao Sun, Shoulin Chen, Amity Lin, Wulin Tan, Liangliang He, Jacob Greene, Virginia Yao, Lijun An, Rich Liang, Qifeng Li, Jessica Yu, Lingyi Zhang, Nikolaos Kyritsis, Xuan Duong Fernandez, Sara Moncivais, Esmeralda Mendoza, Pamela Fung, Gongming Wang, Xinhuan Niu, Qihang Du, Zhaoyang Xiao, Yuwen Chang, Peiyuan Lv, J. Russell Huie, Abel Torres‐Espin, Adam R. Ferguson, Debra D. Hemmerle, Jason F. Talbott, Philip R. Weinstein, Lisa U. Pascual, Vineeta Singh, Anthony M. DiGiorgio, Rajiv Saigal, William D. Whetstone, Geoffrey T. Manley, Sanjay S. Dhall, Jacqueline C. Bresnahan, Mervyn Maze, Xiangning Jiang, Neel S. Singhal, Michael S. Beattie, Hua Su, Zhonghui Guan
Publikováno v:
Clinical and Translational Medicine, Vol 14, Iss 4, Pp n/a-n/a (2024)
Abstract Background Although many molecules have been investigated as biomarkers for spinal cord injury (SCI) or ischemic stroke, none of them are specifically induced in central nervous system (CNS) neurons following injuries with low baseline expre
Externí odkaz:
https://doaj.org/article/05f71d729fcf4e4b9ab7f2a840ded879
Publikováno v:
Ceramics International. 49:9622-9631
Publikováno v:
The International Journal of Advanced Manufacturing Technology. 125:47-71
Autor:
Ni Zhan, Xinhuan Niu, Jianghao Liu, Yida Zuo, Han Yan, Fu Luo, Minghui Qu, Wenhao Xian, Jianwei Zhou
Publikováno v:
ECS Journal of Solid State Science & Technology; Sep2023, Vol. 12 Issue 9, p1-11, 11p
Autor:
Yebo Zhu, Yinchan Zhang, Chenghui Yang, Jiakai Zhou, Wantang Wang, Tianlin Zhang, He Wang, Xinhuan Niu, Ru Wang, Zhi Wang, Ziyang Hou
Publikováno v:
Nano Select. 3:688-702
With integrated circuit (IC) technology nodes below 20 nm, the chemical mechanical polishing (CMP) of cobalt (Co)-based copper (Cu) interconnection has been gradually changed to one-step polishing, which requires rapid removal rate (RR) of Cu while c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eaa472b45f2e69e30d3dae4dacbcdf0d
https://doi.org/10.21203/rs.3.rs-1909550/v1
https://doi.org/10.21203/rs.3.rs-1909550/v1
Autor:
Jiangnan Wu, Yanjing Guo, Wei Li, Zihao Zhang, Xinlei Li, Qidi Zhang, Qihang Du, Xinhuan Niu, Xijiang Liu, Gongming Wang
Publikováno v:
Experimental Neurology. 365:114385
Autor:
Han Yan, Yinchan Zhang, Xinhuan Niu, Jianchao Wang, Chenghui Yang, Fu Luo, Minghui Qu, Yunhui Shi, Ru Wang
Publikováno v:
Thin Solid Films. 774:139843
Publikováno v:
2022 China Semiconductor Technology International Conference (CSTIC).
Publikováno v:
2022 China Semiconductor Technology International Conference (CSTIC).