Zobrazeno 1 - 10
of 41
pro vyhledávání: '"Xinfei Guo"'
Publikováno v:
Integration. 85:87-96
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10dc488ff2369f2b41fa67d9b0a57a10
https://doi.org/10.1016/j.vlsi.2022.04.005
https://doi.org/10.1016/j.vlsi.2022.04.005
Publikováno v:
Proceedings of the Great Lakes Symposium on VLSI 2023.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b0630a05ea044b444418ed63a942fce3
https://doi.org/10.1145/3583781.3590292
https://doi.org/10.1145/3583781.3590292
Autor:
Xinfei Guo
Publikováno v:
Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fef44b98a41ef7f6e71b2c041e3e11eb
https://doi.org/10.1145/3578438
https://doi.org/10.1145/3578438
Autor:
Mohamed El-Hadedy, Xinfei Guo
Publikováno v:
2022 IEEE 4th International Conference on Circuits and Systems (ICCS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d01df6cef6e63d237084fb1f170939b7
https://doi.org/10.1109/iccs56666.2022.9936234
https://doi.org/10.1109/iccs56666.2022.9936234
Publikováno v:
2022 IEEE 35th International System-on-Chip Conference (SOCC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e56e83024367f5ec449cd4a9873f540
https://doi.org/10.1109/socc56010.2022.9908100
https://doi.org/10.1109/socc56010.2022.9908100
Publikováno v:
2022 IEEE 65th International Midwest Symposium on Circuits and Systems (MWSCAS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::973db247320187006c742d22afc02b73
https://doi.org/10.1109/mwscas54063.2022.9859449
https://doi.org/10.1109/mwscas54063.2022.9859449
Publikováno v:
2022 IEEE Computer Society Annual Symposium on VLSI (ISVLSI).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef8b4744ae2d3d362b54d76e5b5451b7
https://doi.org/10.1109/isvlsi54635.2022.00084
https://doi.org/10.1109/isvlsi54635.2022.00084
Publikováno v:
IEEE Solid-State Circuits Magazine. 13:74-77
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::064e8f3fb0dbef5894577ef8469a9317
https://doi.org/10.1109/mssc.2020.3035981
https://doi.org/10.1109/mssc.2020.3035981
Autor:
Xinfei Guo
Publikováno v:
2022 China Semiconductor Technology International Conference (CSTIC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::122973780cc498b64af05165c4fa69e2
https://doi.org/10.1109/cstic55103.2022.9856710
https://doi.org/10.1109/cstic55103.2022.9856710
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b5e5afed8f231ed41a8fd0e46d328f1
https://doi.org/10.1109/itherm54085.2022.9899649
https://doi.org/10.1109/itherm54085.2022.9899649