Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Xin F. Tan"'
Publikováno v:
Nano Select, Vol 3, Iss 8, Pp 1264-1276 (2022)
Abstract Sn‐based lithium‐ion battery anodes show improved capacities over commercial carbon‐based anodes. Furthermore, their higher lithiation potentials reduce the risks of Li dendrite formation. A simple Cu6Sn5 fabrication method has been pr
Externí odkaz:
https://doaj.org/article/9faf1a1cc592489d8f7e14348e04508c
Autor:
Xin F. Tan, Flora Somidin, Stuart D. McDonald, Michael J. Bermingham, Hiroshi Maeno, Syo Matsumura, Kazuhiro Nogita
Publikováno v:
Materials, Vol 15, Iss 2, p 510 (2022)
The complex reaction between liquid solder alloys and solid substrates has been studied ex-situ in a few studies, utilizing creative setups to “freeze” the reactions at different stages during the reflow soldering process. However, full understan
Externí odkaz:
https://doaj.org/article/0677bdc10b0e4aea80217fa283d7c469
Publikováno v:
Journal of Materials Science & Technology. 153:139-158
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::530460f166375c065af4511ebbbb7311
https://doi.org/10.1016/j.jmst.2022.12.054
https://doi.org/10.1016/j.jmst.2022.12.054
Publikováno v:
Journal of Materials Science & Technology. 151:162-177
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7ec61cb1df08ef270f1b7d38325136f
https://doi.org/10.1016/j.jmst.2022.12.015
https://doi.org/10.1016/j.jmst.2022.12.015
Autor:
Nurul R. Abdul Razak, Xin F. Tan, Stuart D. McDonald, Michael J. Bermingham, Jeffery Venezuela, Tetsuro Nishimura, Kazuhiro Nogita
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c19e279a39458405fd8eef5503d53b8e
https://doi.org/10.23919/icep58572.2023.10129722
https://doi.org/10.23919/icep58572.2023.10129722
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa0e002e512bc3fb2c5505e15aa8034c
https://doi.org/10.23919/icep58572.2023.10129743
https://doi.org/10.23919/icep58572.2023.10129743
Publikováno v:
Nano Select. 3:1264-1276
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b06882811c9f0611ba130a45c86a2888
https://doi.org/10.1002/nano.202200056
https://doi.org/10.1002/nano.202200056
Publikováno v:
JOM. 74:1739-1750
The different rates of thermal expansion of the many materials that make up an electronic assembly combined with temperature fluctuations are the driver of the thermal fatigue failure of solder joints. A characteristic of the Sn-Bi system, which prov
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::966766b9ff5c112a992df703736b6a6f
https://doi.org/10.1007/s11837-021-05145-4
https://doi.org/10.1007/s11837-021-05145-4
Autor:
Xin F. Tan, Qichao Hao, Qinfen Gu, Stuart D. McDonald, Keith Sweatman, Michael Bermingham, Kazuhiro Nogita
Publikováno v:
Materials Characterization. 201:112934
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ee4e256d375cefba19e88b3a34be162b
https://doi.org/10.1016/j.matchar.2023.112934
https://doi.org/10.1016/j.matchar.2023.112934
Autor:
Xin F. Tan, Flora Somidin, Stuart D. McDonald, Michael J. Bermingham, Hiroshi Maeno, Syo Matsumura, Kazuhiro Nogita
Publikováno v:
Materials
Materials, Vol 15, Iss 510, p 510 (2022)
Materials; Volume 15; Issue 2; Pages: 510
Materials, Vol 15, Iss 510, p 510 (2022)
Materials; Volume 15; Issue 2; Pages: 510
The complex reaction between liquid solder alloys and solid substrates has been studied ex-situ in a few studies, utilizing creative setups to “freeze” the reactions at different stages during the reflow soldering process. However, full understan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c1c529b9966c5a047837370f1a3b4fc6
https://pubmed.ncbi.nlm.nih.gov/35057226
https://pubmed.ncbi.nlm.nih.gov/35057226