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of 10
pro vyhledávání: '"Xin F. Tan"'
Publikováno v:
Nano Select, Vol 3, Iss 8, Pp 1264-1276 (2022)
Abstract Sn‐based lithium‐ion battery anodes show improved capacities over commercial carbon‐based anodes. Furthermore, their higher lithiation potentials reduce the risks of Li dendrite formation. A simple Cu6Sn5 fabrication method has been pr
Externí odkaz:
https://doaj.org/article/9faf1a1cc592489d8f7e14348e04508c
Publikováno v:
Journal of Materials Science & Technology. 153:139-158
Publikováno v:
Journal of Materials Science & Technology. 151:162-177
Autor:
Nurul R. Abdul Razak, Xin F. Tan, Stuart D. McDonald, Michael J. Bermingham, Jeffery Venezuela, Tetsuro Nishimura, Kazuhiro Nogita
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Publikováno v:
JOM. 74:1739-1750
The different rates of thermal expansion of the many materials that make up an electronic assembly combined with temperature fluctuations are the driver of the thermal fatigue failure of solder joints. A characteristic of the Sn-Bi system, which prov
Autor:
Xin F. Tan, Qichao Hao, Qinfen Gu, Stuart D. McDonald, Keith Sweatman, Michael Bermingham, Kazuhiro Nogita
Publikováno v:
Materials Characterization. 201:112934
Autor:
Xin F. Tan, Flora Somidin, Stuart D. McDonald, Michael J. Bermingham, Hiroshi Maeno, Syo Matsumura, Kazuhiro Nogita
Publikováno v:
Materials
Materials, Vol 15, Iss 510, p 510 (2022)
Materials; Volume 15; Issue 2; Pages: 510
Materials, Vol 15, Iss 510, p 510 (2022)
Materials; Volume 15; Issue 2; Pages: 510
The complex reaction between liquid solder alloys and solid substrates has been studied ex-situ in a few studies, utilizing creative setups to “freeze” the reactions at different stages during the reflow soldering process. However, full understan
Autor:
Xin F. Tan, Manjin Kim, Qinfen Gu, Julio Pinzon Piraquive, Guang Zeng, Stuart D. McDonald, Kazuhiro Nogita
Publikováno v:
Journal of Power Sources. 538:231538
Publikováno v:
Acta Materialia. 226:117661