Zobrazeno 1 - 4
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pro vyhledávání: '"Xin, Shihan"'
Autor:
Xin Shihan, Xin Zhang, He Xiaowu, Guowei David Xiao, Kai Zhang, Deng Shaojia, Xinlu Liu, Yang Chai, Anhui Zhong
Publikováno v:
Nanotechnology. 32(31)
Sintered nano-copper is becoming a promising candidate as thermal interface material (TIM) for die attaching in high power electronics. It exhibits much higher thermal conductivity and operating temperature than conventional TIMs based on polymer and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f1edabab2c9eb721c939739712a6b359
https://pubmed.ncbi.nlm.nih.gov/33910177
https://pubmed.ncbi.nlm.nih.gov/33910177
Akademický článek
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Autor:
Kai Zhang, Jie Li, Chuiming Wan, Zhaoming Zeng, Lisa Liu, Matthew Ming Fai Yuen, Deng Shaojia, Xin Shihan, He Xiaowu, Chengqiang Cui, Yunbo He, Yu Zhang, Cheng Sheng Ku, Guowei David Xiao
Publikováno v:
Materials Letters. 235:216-219
High thermal conductivity, low viscosity and high transparency are desired properties of die attach adhesives (DAA) for LEDs to achieve high thermal and optical performance as well as good reliability. However, it is challenging for DAAs with thermal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da23f15d1a17c9009270cd8db853e068
https://doi.org/10.1016/j.matlet.2018.09.170
https://doi.org/10.1016/j.matlet.2018.09.170
Autor:
Zhang, Kai, Xiao, Guowei David, Zeng, Zhaoming, Wan, Chuiming, Li, Jie, Xin, Shihan, He, Xiaowu, Deng, Shaojia, Zhang, Yu, Cui, Chengqiang, He, Yunbo, Liu, Lisa, Ku, Cheng Sheng, Yuen, Matthew M.F.
Publikováno v:
In Materials Letters 15 January 2019 235:216-219