Zobrazeno 1 - 10
of 179
pro vyhledávání: '"Ximei, Liu"'
Autor:
Xiaomei Huang, Xin Zhou, Xueqing Liu, Wen Zhong, Xinyu Wang, Zhengchun Ju, Yan Yin, Qingguo Xin, Ning Liu, Ximei Liu, Yuli Jin, Guie Wang, Jiangchun Wang, Pengtao Ma
Publikováno v:
Frontiers in Nutrition, Vol 11 (2024)
BackgroundBread wheat is one of the most important food crops associated with ensuring food security and human nutritional health. The starch quality is an important index of high-quality wheat. It is affected by a complex series of factors; among wh
Externí odkaz:
https://doaj.org/article/39e0ade0c49f4510aed28063104c5d90
Publikováno v:
Colloids and Interfaces, Vol 8, Iss 5, p 48 (2024)
As the information age progresses, the electronics industry is evolving towards smaller and more sophisticated products. However, electrostatic potentials easily penetrate these components, causing damage. This underscores the urgent need for materia
Externí odkaz:
https://doaj.org/article/dacc4e28fbd649dd9ea40234ac843990
Publikováno v:
Nanomaterials, Vol 14, Iss 13, p 1128 (2024)
The exploitation of clean and efficient fire extinguishing materials has substantial implications for improving disaster prevention, mitigation, and relief capabilities, maintaining public safety, and protecting people’s lives and property as well
Externí odkaz:
https://doaj.org/article/35237d9f14e64f8e9d99409667ca0c53
Publikováno v:
PLoS ONE, Vol 19, Iss 9, p e0297591 (2024)
In the context of the "dual carbon goals" and intensified international manufacturing competition, the green and high-end transformation of manufacturing is the direction for the industry's future growth in China. The study discusses the effect of pr
Externí odkaz:
https://doaj.org/article/3583c88e004a4108b7932f074e0a2354
Publikováno v:
Opto-Electronic Advances, Vol 4, Iss 10, Pp 1-10 (2021)
Q-switched lasers have occupied important roles in industrial applications such as laser marking, engraving, welding, and cutting due to their advantages in high pulse energy. Here, SnS2-based Q-switched lasers are implemented. Considering that SnS2
Externí odkaz:
https://doaj.org/article/99da6bfb42f04b6da76e3e1909f3f4c8
Publikováno v:
Nanomaterials, Vol 13, Iss 17, p 2465 (2023)
Strain sensors based on conducting polymer hydrogels are considered highly promising candidates for wearable electronic devices. However, existing conducting polymer hydrogels are susceptible to aging, damage, and failure, which can greatly deteriora
Externí odkaz:
https://doaj.org/article/2526355c8b4b40e58862f8f6869ecd94
Autor:
Meihang Li, Ximei Liu
Publikováno v:
IET Control Theory & Applications, Vol 15, Iss 9, Pp 1230-1245 (2021)
Abstract This paper considers the iterative parameter estimation for a dual‐rate sampled‐data bilinear system with autoregressive moving average noise. Through combining the auxiliary model identification idea with the data filtering technique, t
Externí odkaz:
https://doaj.org/article/48cbbfb3ec884842b5410a6c86da2ad0
Autor:
Wen Wang, Jie Cao, Jiawen Yu, Fajuan Tian, Xiaoyu Luo, Yiting Hao, Jiyan Huang, Fucheng Wang, Weiqiang Zhou, Jingkun Xu, Ximei Liu, Hanjun Yang
Publikováno v:
Polymers, Vol 15, Iss 8, p 1856 (2023)
Supercapacitors are widely used in various fields due to their high power density, fast charging and discharging speeds, and long service life. However, with the increasing demand for flexible electronics, integrated supercapacitors in devices are al
Externí odkaz:
https://doaj.org/article/43317979a22e44b4ab06999ebd2f4091
Publikováno v:
Nano Select, Vol 2, Iss 1, Pp 37-46 (2021)
Abstract Due to the special working wavelength and superb beam quality, the mid‐infrared fiber laser has a wide application prospect in the fields of biomedicine, military defense, laser manufacturing, atmospheric detection, space communication, et
Externí odkaz:
https://doaj.org/article/d01e17dd227b48d1b1adc83d1ae96d60
Publikováno v:
IEEE Access, Vol 8, Pp 108555-108560 (2020)
Through-silicon-via (TSV) is an advanced 3D electronic integration technology. In order to achieve the defect-free filling of deep TSV, forced convection is commonly applied during TSV filling process. In this study, the interaction effect of forced
Externí odkaz:
https://doaj.org/article/cd61095d5d4e49b3a284974d0b80d446