Zobrazeno 1 - 10
of 216
pro vyhledávání: '"Xiaoxiong Gu"'
Publikováno v:
IEEE Journal of Microwaves, Vol 1, Iss 1, Pp 123-134 (2021)
This article reviews current research and development as well as future opportunities for packaging and antenna integration technologies for silicon-based millimeter-wave phased arrays in emerging communication applications. Implementations of state-
Externí odkaz:
https://doaj.org/article/9817296e859e404980e84a20b84c7999
Autor:
Bodhisatwa Sadhu, Arun Paidimarri, Duixian Liu, Mark Yeck, Caglar Ozdag, Yujiro Tojo, Wooram Lee, Kevin Xiaoxiong Gu, Jean-Olivier Plouchart, Christian W. Baks, Yusuke Uemichi, Sudipto Chakraborty, Yo Yamaguchi, Ning Guan, Alberto Valdes-Garcia
Publikováno v:
IEEE Journal of Solid-State Circuits. 57:3599-3616
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47108a8dbbd6550c39cd3663860b2c2b
https://doi.org/10.1109/jssc.2022.3204807
https://doi.org/10.1109/jssc.2022.3204807
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e681644605c43cbb64241c2f3133a13
https://doi.org/10.1109/ectc51906.2022.00338
https://doi.org/10.1109/ectc51906.2022.00338
Autor:
Xiaoxiong Gu, Pritish R. Parida
Publikováno v:
Antenna-in-Package Technology and Applications
As antenna element size and pitch are in the order of millimeters, i.e. comparable to wavelength at millimeter‐wave (mmWave) frequencies, antenna‐in‐package (AiP) solutions are more feasible for design and manufacturing than at other frequencie
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e9129a386ee8027bb043d421be896805
https://doi.org/10.1002/9781119556671.ch4
https://doi.org/10.1002/9781119556671.ch4
Autor:
Duixian Liu, Xiaoxiong Gu
Publikováno v:
Antenna-in-Package Technology and Applications
The increasing capabilities of high‐speed silicon technologies have made millimeter‐wave frequencies attractive for low‐cost applications. This chapter focuses on large‐array antenna‐in‐package (AiP) designs based on surface laminar circu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c52f2d07496e62936f4ee985eefa67c
https://doi.org/10.1002/9781119556671.ch10
https://doi.org/10.1002/9781119556671.ch10
Autor:
Bodhisatwa Sadhu, Arun Paidimarri, Wooram Lee, Mark Yeck, Caglar Ozdag, Yujiro Tojo, Jean-Olivier Plouchart, Xiaoxiong Gu, Yusuke Uemichi, Sudipto Chakraborty, Yo Yamaguchi, Ning Guan, Alberto Valdes-Garcia
Publikováno v:
2022 IEEE International Solid- State Circuits Conference (ISSCC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ee97933693279f281a95d6fb3e111da
https://doi.org/10.1109/isscc42614.2022.9731778
https://doi.org/10.1109/isscc42614.2022.9731778
Autor:
Prasanthi Maddala, Xiaoxiong Gu, Ivan Seskar, Panagiotis Skrimponis, Jakub Kolodziejski, Arun Paidimarri, Sundeep Rangan, Tingjun Chen, Gil Zussman
Publikováno v:
WiNTECH@MOBICOM
While millimeter-wave (mmWave) wireless has recently gained tremendous attention with the transition to 5G, developing a broadly accessible experimental infrastructure will allow the research community to make significant progress in this area. Hence
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e04b1bc62849f369b559556323fdd3a
https://doi.org/10.1145/3477086.3480834
https://doi.org/10.1145/3477086.3480834
Autor:
Alberto Valdes-Garcia, Bodhisatwa Sadhu, Arun Paidimarri, Mark Yeck, Young H. Kwark, Ivan Seskar, Gil Zussman, Stanislav Lukashov, Xiaoxiong Gu, Christian W. Baks, Tingjun Chen
Publikováno v:
2021 IEEE MTT-S International Microwave Symposium (IMS).
This paper reports the development of a compact and highly programmable 28-GHz phased array subsystem that is currently being integrated in a city-scale testbed for advanced wireless research and experimentation. The subsystem hardware consists of a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f3317fb0d14eedfe17e718d181d89f3
https://doi.org/10.1109/ims19712.2021.9574864
https://doi.org/10.1109/ims19712.2021.9574864
Autor:
Yuki Suto, Bodhisatwa Sadhu, Yuta Hasegawa, Arun Paidimarri, Duixian Liu, Xiaoxiong Gu, Ning Guan, Yujiro Tojo, Christian W. Baks, Alberto Valdes-Garcia
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
This paper presents novel antenna designs and integration methods that enable a low-cost scalable antenna-in-package (AiP) phased-array solution for wideband wireless communication covering 24 GHz - 30 GHz (N257, N258 and N261 5G bands). A total numb
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::946f50373979502a3569ca8a0abeea69
https://doi.org/10.1109/ectc32696.2021.00187
https://doi.org/10.1109/ectc32696.2021.00187
Autor:
Bodhisatwa Sadhu, Pritish R. Parida, Leonard Rexberg, Young H. Kwark, Ola Tageman, Xiaoxiong Gu, Joakim Hallin, Alberto Valdes-Garcia, Duixian Liu, Christian W. Baks
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 67:2975-2984
Silicon-based millimeter-wave (mm-wave) phased-array technologies are enabling directional wireless data communications at Gb/s speeds. In this paper, we review and discuss the challenges of implementing a multichip phased-array antenna module for mm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::55771c46e3285afb156c7f885627293a
https://doi.org/10.1109/tmtt.2019.2912819
https://doi.org/10.1109/tmtt.2019.2912819