Zobrazeno 1 - 10
of 42
pro vyhledávání: '"Xiaokang Guan"'
Publikováno v:
Heliyon, Vol 10, Iss 20, Pp e39602- (2024)
Periodic drought adversely affects the growth and yield of summer crops in the Huang-Huai-Hai Plain. Drought-rewatering practice as one of the important agronomic measures to improve crop drought resistance. A field experiment was conducted to invest
Externí odkaz:
https://doaj.org/article/ece6d442e64b4ee1b7b52b743f25b53b
Publikováno v:
Ecological Indicators, Vol 154, Iss , Pp 110781- (2023)
Seasonal drought is a major limiting factor for wheat production in the North China Plain. The use of non-destructive screening tools based on vegetation indices associated with physiological and biochemical traits will help in the identification of
Externí odkaz:
https://doaj.org/article/7124e84a5c9a43a3a9cbd8ab80f2b12a
Publikováno v:
Metabolites, Vol 14, Iss 3, p 131 (2024)
With its high resolving power and sensitivity, mass spectrometry is considered the most informative technique for metabolite qualitation and quantification in the plant sciences. However, the spatial location information, which is crucial for the exp
Externí odkaz:
https://doaj.org/article/f0dab55a35014ec4b72408823d20d563
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d57fc34c725eacdb9e01c69ff0be1c59
https://doi.org/10.2139/ssrn.4246456
https://doi.org/10.2139/ssrn.4246456
Publikováno v:
Analytical chemistry. 93(44)
Atmospheric pressure mass spectrometry imaging (AP-MSI) is a powerful tool in many fields; however, there are still some difficulties to achieve high spatial resolution for AP-MSI, one of them being the need for a small ablation crater. Here, a fiber
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::22131c13ee7580c2587beafe6b82857a
https://pubmed.ncbi.nlm.nih.gov/34699179
https://pubmed.ncbi.nlm.nih.gov/34699179
Autor:
Xiaokang Guan, Xin Wang, He Tang, Siqiang Fan, Hui Zhao, Lin Lin, Qiang Fang, Jian Liu, Albert Wang, Liwu Yang
Publikováno v:
IEEE Transactions on Industrial Electronics. 58:2736-2743
Electrostatic discharge (ESD) failure is a major reliability problem, and ESD protection is an emerging design challenge for radio-frequency (RF) integrated circuits demanding extremely high reliability for wireless applications in harsh environments
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1bcf1a68162a4d067d198dd94b00e146
https://doi.org/10.1109/tie.2010.2057234
https://doi.org/10.1109/tie.2010.2057234
Autor:
Haigang Feng, Litian Liu, Chen Yang, Feng Liu, Guang Chen, Tian-Ling Ren, Xiaokang Guan, Albert Wang
Publikováno v:
IEEE Electron Device Letters. 28:652-655
This letter reports the design and fabrication of on-chip radio-frequency (RF) inductors with integrated-ferrite thin Alms, which show substantial improvement over air-cored inductors, e.g., 19%-38% and 17%-28% increase in inductance (L) for Y2.8B0.2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24feeb67ea163bf52014898e0e0a028e
https://doi.org/10.1109/led.2007.900299
https://doi.org/10.1109/led.2007.900299
Autor:
Xiaokang Guan, Albert Wang, Haigang Feng, Zhihua Wang, Rouying Zhan, Guang Chen, Chun Zhang, Haolu Xie, Q. Wu
Publikováno v:
IEEE Transactions on Electron Devices. 52:1304-1311
Radio frequency (RF) electrostatic discharge (ESD) protection design emerges as a new challenge to RF integrated circuits (IC) design, where the main problem is associated with the complex interactions between the ESD protection network and the core
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b70c4bb5e15a07cf61f1e2685a0ec0c0
https://doi.org/10.1109/ted.2005.850652
https://doi.org/10.1109/ted.2005.850652
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 23:1421-1428
On-chip electrostatic discharge (ESD) protection design is a challenging IC design problem. New computer-aided design (CAD) tools are essential to ESD protection design prediction and verification at full chip level. This paper reports a novel smart
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::00cb351e7fc2e7245c6fedd16e8c863d
https://doi.org/10.1109/tcad.2004.833613
https://doi.org/10.1109/tcad.2004.833613