Zobrazeno 1 - 10
of 133
pro vyhledávání: '"Xiao Tianjin"'
Publikováno v:
2015 China Semiconductor Technology International Conference.
Continued scaling of the gate dielectric has driven the adoption of high-k materials for the gate stack. A key challenge for enabling the adoption of these high-k materials is providing a SiO2/SiON interfacial layer in a controlled and repeatable man
Autor:
Albert Pang, Fang Jingxun, Jing Xubin, Cao Wenjie, He Zhibin, Liu Wei, Qiu Yuming, Yu Deqin, Xiao Tianjin
Publikováno v:
2015 China Semiconductor Technology International Conference.
For 40nm technology node, the Nickel Silicide process is widely used due to advantages such as low silicon consumption and low stress. In the meantime, a pre-amorphous implantation is necessary for Nickel Silicide formation to eliminate dislocations
Publikováno v:
E3S Web of Conferences; 11/27/2024, Vol. 598, p1-3, 3p
Autor:
Pal, Tunde, Iantovics, Laszlo Barna, Preg, Zoltan, Nemes-Nagy, Eniko, Nyulas, Kinga-Ilona, Baba, Dragos-Florin, German-Sallo, Marta
Publikováno v:
Frontiers in Public Health; 9/27/2024, p1-11, 11p
Autor:
Huang, Ke1,2,3 (AUTHOR), Feng, Ming4 (AUTHOR), Wu, Ying5 (AUTHOR), Wang, Dongxiao6,7 (AUTHOR) dxwang@scsio.ac.cn, Zhou, Wen8 (AUTHOR), Zu, Tingting1,3 (AUTHOR), Wang, Weiqiang1,3 (AUTHOR) weiqiang.wang@scsio.ac.cn, Xie, Qiang1,9 (AUTHOR), Yang, Lei1,3 (AUTHOR), Yao, Jinglong1,3 (AUTHOR), Zhou, Wei1,3 (AUTHOR)
Publikováno v:
Journal of Physical Oceanography. Dec2022, Vol. 52 Issue 12, p3309-3329. 21p.
Publikováno v:
Journal of Physics: Conference Series; 2024, Vol. 2914 Issue 1, p1-2, 2p
Autor:
KE HUANG1,2,3, DONGXIAO WANG4,5 dxwang@mail.sysu.edu.cn, MING FENG6, WEIQING HAN7, GENGXIN CHEN1,2,3 chengengxin@scsio.ac.cn, CHAOJIAO SUN6, XIAOLIN ZHANG7,8, QIANG XIE1,9,10, WEIQIANG WANG1,2,3, QINYAN LIU1,2,3, JINGLONG YAO1,2,3
Publikováno v:
Journal of Physical Oceanography. Sep2020, Vol. 50 Issue 9, p2591-2607. 17p.
Publikováno v:
Psychological Reports. 2024 Suppl 1, Vol. 127, p16S-340S. 1p.
Publikováno v:
Journal of the Air & Waste Management Association (Taylor & Francis Ltd); May2023, Vol. 73 Issue 5, p345-361, 17p
Publikováno v:
Journal of International Obstetrics & Gynecology. Aug2019, Vol. 46 Issue 4, p397-401. 5p.