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Orthorhombic phase induced ultra-low operation voltage in La-doped BiFeO3 resistive switching devices

Autor: Su, Rui, Zhao, Yuwei, Xiao, Ruizi, Dong, Awei, Yuan, Zhengze, Cheng, Weiming, Yang, Rui, Yan, Junbing, Wang, Yongchao, Gong, Mingxing, Miao, Xiangshui

Publikováno v: In Ceramics International 1 September 2023 49(17) Part A:28080-28088

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Oxygen Vacancy Compensation-Induced Analog Resistive Switching in the SrFeO 3-δ /Nb:SrTiO 3 Epitaxial Heterojunction for Noise-Tolerant High-Precision Image Recognition.

Autor: Su R; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan 430074, China.; Department of Electrical and Electronic Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong 999077, China., Chen D; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan 430074, China., Cheng W; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan 430074, China., Xiao R; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan 430074, China., Deng Y; Department of Electrical and Electronic Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong 999077, China., Duan Y; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan 430074, China., Li Y; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan 430074, China., Ye L; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan 430074, China., An H; College of New Materials and New Energies, Shenzhen Technology University, Shenzhen 518118, China., Xu J; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan 430074, China., Lai PT; Department of Electrical and Electronic Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong 999077, China., Miao X; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan 430074, China.

Publikováno v: ACS applied materials & interfaces [ACS Appl Mater Interfaces] 2024 Oct 09; Vol. 16 (40), pp. 54115-54128. Date of Electronic Publication: 2024 Sep 27.