Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Xianshi Jia"'
Autor:
Zhou Li, Junhao Li, Tong Shen, Daoguang He, Xianshi Jia, Shiqi Xia, Jingwei Zhao, Rui Wang, Zhengyi Jiang
Publikováno v:
Journal of Materials Research and Technology, Vol 30, Iss , Pp 3297-3307 (2024)
Examining the cryogenic-temperature characteristics of composites is imperative for ensuring the sustained functionality of their components in environments with cryogenic temperatures. The plastic deformation and fracture mechanisms of a novel Al/Mg
Externí odkaz:
https://doaj.org/article/a0b11303e6624edb8b068db0fc6cc164
Autor:
Xianshi Jia, Jinlin Luo, Chuan Guo, Zhou Li, Zhuang Ma, Yang Xiang, Zhaoxi Yi, Kai Li, Cong Wang, Xin Li, Kai Han, Ji'an Duan
Publikováno v:
Journal of Materials Research and Technology, Vol 27, Iss , Pp 5389-5403 (2023)
The development of high-energy continuous wave (CW) laser has enabled the generation of output powers ranging from 300 to 500 kW. Understanding the ablation mechanism of CW lasers at high laser fluence is crucial for the design of effective high-ener
Externí odkaz:
https://doaj.org/article/3ea1b98348ac4bc99f93c45b4bf06d6b
Publikováno v:
Nanomaterials, Vol 14, Iss 1, p 114 (2024)
Understanding plastic deformation behaviour is key to optimising the mechanical properties of nano-polycrystalline layered composites. This study employs the molecular dynamics (MD) simulation to comprehensively investigate the effects of various fac
Externí odkaz:
https://doaj.org/article/c5326e632e1749f787632861bfa33224
Publikováno v:
International Journal of Optics, Vol 2022 (2022)
The fluorescence radiation property at the edge of the thin disk crystal is very important to the design of thin disk lasers. In order to study this effect, in this paper, we established a theoretical model to describe the edge fluorescence radiation
Externí odkaz:
https://doaj.org/article/d2511d4c091045829370f49a2207df9a
Publikováno v:
Nanomaterials, Vol 12, Iss 2, p 230 (2022)
The high-quality, high-efficiency micro-hole drilling of structural ceramics to improve the thermal conductivity of hot-end parts or achieve high-density electronic packaging is still a technical challenge for conventional processing techniques. Rece
Externí odkaz:
https://doaj.org/article/aa35efebf3e049eb9aa2a0a5ab4d5d03
Autor:
Cong Wang, Jiamin Quan, Linpeng Liu, Peilin Cao, Kaiwen Ding, Yulong Ding, Xianshi Jia, Dejin Yan, Nai Lin, Ji'an Duan
Publikováno v:
Journal of Materials Chemistry A; 6/21/2024, Vol. 12 Issue 23, p13994-14004, 11p
Publikováno v:
Welding in the World. 67:593-605
Publikováno v:
Journal of Materials Science: Materials in Electronics. 33:24493-24505
Publikováno v:
Optics & Laser Technology. 164:109481
Publikováno v:
Optics & Laser Technology. 161:109164