Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Xiang Sheng Xie"'
Autor:
Yan Feng Li, Xiu Ling Ma, Shan Long Qi, Yong Zhen Li, Xiang Sheng Xie, Guo Jie Huang, Xiang Qian Yin, Xi Cheng, Zi Ming Li, En Dong Yao
Publikováno v:
Materials Science Forum. 944:205-211
Under the condition of controlling the relevant electrolysis process parameters, 12μm-thick electrolytic copper foils were prepared by adjusting the electrodeposition time under different current densities. The surface morphology, mechanical propert
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9dc969c657539af20e8770ac53fb32e
https://doi.org/10.4028/www.scientific.net/msf.944.205
https://doi.org/10.4028/www.scientific.net/msf.944.205
Publikováno v:
Applied Mechanics and Materials. :2130-2134
At a switching point, the inconsistency can exist between subsystems switched before and after the point, resulting in the solutions of singular switched system with time delay there may be discontinuity. We consider the discontinuity of the solution
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36ee3d950f142c625b3e1c61017eca74
https://doi.org/10.4028/www.scientific.net/amm.55-57.2130
https://doi.org/10.4028/www.scientific.net/amm.55-57.2130
Autor:
Xiang-sheng Xie, Yi-qing Chen
Publikováno v:
Acta Mathematicae Applicatae Sinica, English Series. 21:153-156
This note complements a recent study in ruin theory with risky investment by establishing the same asymptotic estimate for the finite time ruin probability under a weaker restriction on the financial risks. In particular, our result applies to a crit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::edb2a87bf9313a27493807f38a03bd56
https://doi.org/10.1007/s10255-005-0226-y
https://doi.org/10.1007/s10255-005-0226-y
Publikováno v:
Advances in Optoelectronics & Micro/Nano-Optics (AOM), 2010 OSA-IEEE-COS; 2010, p1-5, 5p
Autor:
Yi-qing Chen, Xiang-sheng Xie
Publikováno v:
Acta Mathematicae Applicatae Sinica; Feb2005, Vol. 21 Issue 1, p153-156, 4p