Zobrazeno 1 - 10
of 45
pro vyhledávání: '"Xiang Qian Yin"'
Publikováno v:
Frontiers in Oncology, Vol 12 (2022)
The RTK/RAS pathway is an oncogenic signaling pathway for which many targeted drugs have been developed; however, survival remains poor. A combination of targeted therapy and immunotherapy has emerged as an option for improving cancer treatment respo
Externí odkaz:
https://doaj.org/article/7731a901251148ba8150eaa8aea8f76d
Microstructural evolution and properties of a Cu–Cr–Ag alloy during continuous manufacturing process
Autor:
Haofeng Xie, Xu-Jun Mi, Xiang-Qian Yin, Yang Zhen, Xue Feng, Gaolei Xu, Guo-Jie Huang, Li-Jun Peng
Publikováno v:
Rare Metals. 40:2213-2220
Microstructure evolution and properties of a Cu–Cr–Ag alloy during the continuous manufacturing process were investigated in detail by scanning electron microscopy (SEM) and transmission electron microscopy (TEM) in the study. The Cu–Cr–Ag al
Autor:
Yan Feng Li, Xiu Ling Ma, Shan Long Qi, Yong Zhen Li, Xiang Sheng Xie, Guo Jie Huang, Xiang Qian Yin, Xi Cheng, Zi Ming Li, En Dong Yao
Publikováno v:
Materials Science Forum. 944:205-211
Under the condition of controlling the relevant electrolysis process parameters, 12μm-thick electrolytic copper foils were prepared by adjusting the electrodeposition time under different current densities. The surface morphology, mechanical propert
Autor:
Li Jun Peng, Xu Jun Mi, Yang Yu, Zhen Yang, Hao Feng Xie, Xiang Qian Yin, Guo Jie Huang, Xue Feng
Publikováno v:
Materials Science Forum. 941:1613-1617
The Cr precipitation sequence in Cu-Cr-Zr-Ag alloy during the aging process at 450°C could be obtained by Transmission electron microscopy (TEM) and High-resolution transmission microscopy (HRTEM) in the study. The strengthening curve shows a unimod
Autor:
Yanfeng Li, Xiang-Qian Yin, Yang Zhen, Li-Jun Peng, Xu-Jun Mi, Guo-Jie Huang, Xue Feng, Haofeng Xie
Publikováno v:
Rare Metals. 39:1419-1424
Interface microstructures of Cu–Ni–Si/Al–Mg–Si clad composite wires during isothermal annealing from 623 to 773 K were investigated. The composite wires were fabricated by a drawing process. The evolution of intermetallic compounds (IMCs) was
Autor:
Yan Feng Li, Guo Jie Huang, Xue Shuai Li, Qing An Sun, Ke Bin Sun, Xiang Qian Yin, Ye Xin Jiang
Publikováno v:
Materials Science Forum. 921:231-235
Copper foils with 91% cold rolled deformation annealed at temperature between 140°C and 170 °C.The microstructures were observed by EBSD. The mechanical properties were measured at room temperature by tensile test machine and the fracture morpholog
Autor:
Guo Jie Huang, Zhen Yang, Xu Jun Mi, Xiang Qian Yin, Hao Feng Xie, Li Jun Peng, Zong Wu Li, Xue Feng
Publikováno v:
Materials Science Forum. 921:141-146
In this paper, nominal composition of Cu-0.3Cr-0.07Ag (at%) was designed. The high temperature properties and microstructure were investigated by Transmission electron microscopy (TEM) and scanning electron microscopy (SEM). The results show that the
Autor:
Haofeng Xie, Xu-Jun Mi, Limin Zhao, Li-Jun Peng, Yang Zhen, Xue Feng, Guo-Jie Huang, Xiang-Qian Yin
Publikováno v:
Rare Metals. 40:934-938
In order to increase both the interfacial strength and interphase region strength between TiNi wires and shape memory epoxy, a novel interface structure including aminated CNTs was designed. The morphology shows that after electroplating and etching,
Publikováno v:
Key Engineering Materials. 727:154-158
The characteristics of isothermal deformation behavior of Ti-50.8%Ni shape memory alloys were investigated by thermal simulation tests, which were performed on Gleeble-3500 thermal simulation machine. The range of deformation temperatures was 800°C
Autor:
Xue Feng, Li Jun Peng, Bao Dong Gao, Yan Feng Li, Hao Feng Xie, Limin Zhao, Xu Jun Mi, Xiang Qian Yin
Publikováno v:
Key Engineering Materials. 727:537-540
Shape memory composites (SMCs) combined with shape memory polymer (SMP) and shape memory alloy (SMA) having excellent mechanical properties and shape memory properties are considered to be ideal materials used in smart adaptive structure. In order to