Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Xiang Jun Ma"'
Publikováno v:
International Breastfeeding Journal, Vol 16, Iss 1, Pp 1-8 (2021)
Abstract Background This study aimed to identify the differences in clinical characteristics, puncture efficacy, antibiotic use, treatment duration, breastfeeding post-illness, and recurrence of patients with breast abscesses caused by methicillin-re
Externí odkaz:
https://doaj.org/article/2304aa583b79430f9f8b3f3ea349a62b
Autor:
Xiang-Jun Ma, Yan Li
Publikováno v:
Breastfeeding Medicine. 16:894-898
Background: Ultrasound-guided fine-needle aspiration in the treatment of breast abscess has become the preferred treatment. Although fine-needle aspiration has a good therapeutic effect, there are ...
Publikováno v:
Acta Crystallographica Section E, Vol 65, Iss 8, Pp o1815-o1815 (2009)
In the crystal structure of the title compound, C7H10N2O2S, a benzoic acid derivative, intermolecular N—H...O interactions link the molecules into a three-dimensional network.
Externí odkaz:
https://doaj.org/article/bc7d2b621ba044c9910176fcca23a6ed
Publikováno v:
Breastfeeding Medicine; Nov2021, Vol. 16 Issue 11, p894-898, 5p
Autor:
Song-tao Ding, Xiang-ping He, Xiang-jun Ma, Yi Zhang, Xing-xing Liu, Jing Qin, Ding, Song-Tao, He, Xiang-Ping, Ma, Xiang-Jun, Zhang, Yi, Liu, Xing-Xing, Qin, Jing
Publikováno v:
Breastfeeding Medicine; Jul2020, Vol. 15 Issue 7, p471-474, 4p
Publikováno v:
Advanced Materials Research. :346-350
Heat dissipation of high-power LED lamps has become a key technology to LED package due to the improvement of the LED output power. A detailed simulation of temperature distribution of three chips high-power LED tube lamp was made by finite element m
Publikováno v:
Advanced Materials Research. :2531-2536
An actual packaging structural of high power three-chip white LED lamp is designed. The highest temperature of LED chip is 111.2°C, and the temperature range of heat sink is 72.6°C~73.8°C by finite element method (FEM). The respective temperatur
Publikováno v:
2011 International Conference on Electronics, Communications and Control (ICECC).
Even though light-emitting diodes may have a very long life, poorly designed LED lamp can experience a short life. A simulation of temperature distribution of four chips high-power LED down-light was made by finite element method. Based on the consis
Autor:
Kun Bai, Qiuhua Nie, Bo-you Zhou, Fa-wei Zhang, Xiang-jun Ma, Li-gang Wu, Zhao-yong Zheng, Shixun Dai
Publikováno v:
2011 International Conference on Electronics, Communications and Control (ICECC).
This paper designs a packaging structural of six-chip white LED down light with a total power of 15 W. The highest temperature of LED chip is 110.5°C, and the temperature of heat sink is 71.6 °C ∼73.2°C by finite element method (FEM). The experi