Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Xia Weishen"'
Publikováno v:
In Chemical Engineering Journal 15 July 2017 320:588-607
Autor:
Xia Weishen, Liu Ruhua, Cai Xionghui, Wang Shen, Chen Guang, Wu Fengshun, Zhu Wenbo, Zhang Yi
Publikováno v:
2014 15th International Conference on Electronic Packaging Technology.
Thermal interface materials (TIMs) which consist of metal foil and soft cushion are used in the process of chip processor platform validation (PPV) process, and some defects, such as the stains caused by debris peeled off from TIMs due to stress conc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d51c36f5e882ba6e4dc34074090bbb9d
https://doi.org/10.1109/icept.2014.6922671
https://doi.org/10.1109/icept.2014.6922671
Publikováno v:
2014 15th International Conference on Electronic Packaging Technology; 2014, p1-23, 23p
Publikováno v:
2014 15th International Conference on Electronic Packaging Technology; 2014, p1-34, 34p
Publikováno v:
2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials & Devices & Workshop on Piezoresponse Force Microscopy; 2014, p1-23, 23p
Publikováno v:
2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials & Devices & Workshop on Piezoresponse Force Microscopy; 2014, p1-34, 34p