Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Xenia Tsilimigkra"'
Autor:
Konstantina Zafeiropoulou, Christina Kostagiannakopoulou, Anna Geitona, Xenia Tsilimigkra, George Sotiriadis, Vassilis Kostopoulos
Publikováno v:
Materials, Vol 14, Iss 19, p 5828 (2021)
The objective of the present study is the assessment of the impact performance and the concluded thermal conductivity of epoxy resin reinforced by layered Graphene Nano-Platelets (GNPs). The two types of used GNPs have different average thicknesses,
Externí odkaz:
https://doaj.org/article/a4b3f1a55e8545e6834c1c8d64e34059
Autor:
Xenia Tsilimigkra, Dimitrios Bekas, Maria Kosarli, Stavros Tsantzalis, Alkiviadis Paipetis, Vassilis Kostopoulos
Publikováno v:
Applied Sciences, Vol 10, Iss 17, p 5739 (2020)
Microcapsule-based carbon fiber reinforced composites were manufactured by wet layup, in order to assess their mechanical properties and determine their healing efficiency. Microcapsules at 10%wt. containing bisphenol-A epoxy, encapsulated in a urea
Externí odkaz:
https://doaj.org/article/8c919c1307274df5b3b974ccd06949d7
Autor:
C. Kostagiannakopoulou, Xenia Tsilimigkra, Anna Geitona, G. Sotiriadis, Konstantina Zafeiropoulou, Vassilis Kostopoulos
Publikováno v:
Materials
Volume 14
Issue 19
Materials, Vol 14, Iss 5828, p 5828 (2021)
Volume 14
Issue 19
Materials, Vol 14, Iss 5828, p 5828 (2021)
The objective of the present study is the assessment of the impact performance and the concluded thermal conductivity of epoxy resin reinforced by layered Graphene Nano-Platelets (GNPs). The two types of used GNPs have different average thicknesses,
Autor:
D.G. Bekas, Vassilis Kostopoulos, Alkiviadis S. Paipetis, Maria Kosarli, S. Tsantzalis, Xenia Tsilimigkra
Publikováno v:
Applied Sciences
Volume 10
Issue 17
Applied Sciences, Vol 10, Iss 5739, p 5739 (2020)
Volume 10
Issue 17
Applied Sciences, Vol 10, Iss 5739, p 5739 (2020)
Microcapsule-based carbon fiber reinforced composites were manufactured by wet layup, in order to assess their mechanical properties and determine their healing efficiency. Microcapsules at 10%wt. containing bisphenol-A epoxy, encapsulated in a urea