Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Xavier Lafontan"'
Autor:
Francis Pressecq, Petra Schmitt, Xavier Lafontan, F. Flourens, Lionel Buchaillot, Patrick Pons, Dominique Collard, Q.H. Duong
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, 2005, 45, pp.1790-1793
Microelectronics Reliability, Elsevier, 2005, 45, pp.1790-1793
Microelectronics Reliability, 2005, 45, pp.1790-1793
Microelectronics Reliability, Elsevier, 2005, 45, pp.1790-1793
The reliability of RF MEMS switches is closely linked to their operational and environmental conditions. This paper examines the reliability of five different capacitive switch designs by a combined use of modeling and experimental tools. Three-dimen
Autor:
Daniel Esteve, Francis Pressecq, Jean Marc Nicot, Q.H. Duong, Xavier Lafontan, Petra Schmitt, Coumar Oudea, Patrick Pons, Henri Camon, Jean-Yves Fourniols
Publikováno v:
Microelectronics Reliability. 43:1957-1962
Autor:
J.-L. Roux, Francis Pressecq, C. Le-Touze, J. Kuchenbecker, Muriel Dardalhon, Djemel Lellouchi, B. Baradat, Felix Beaudoin, Xavier Lafontan, Sebastien Rigo, Jean Marc Nicot, Petra Schmitt
Publikováno v:
Microelectronics Reliability. 43:1061-1083
An overview of the MEMS activity at the French Space Agency (CNES) is presented. At present, MEMS are in the introduction phase and failure analysis and quality assurance (FA/QA) activities are underway for a large variety of MEMS technologies. This
Autor:
Sebastien Risler, Xavier Lafontan
Publikováno v:
WiSEE
Publikováno v:
16th Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS
DTIP: Design, Test, Integration and Packaging
DTIP: Design, Test, Integration and Packaging, Apr 2014, Cannes, France. pp.368-371, ⟨10.1109/DTIP.2014.7056699⟩
DTIP: Design, Test, Integration and Packaging
DTIP: Design, Test, Integration and Packaging, Apr 2014, Cannes, France. pp.368-371, ⟨10.1109/DTIP.2014.7056699⟩
International audience; Cleanrooms are classified by the cleanliness of air and surface. Classification defined by ISO 14644-1 and 14644-9 is given by the number of particle larger than a critical size in a quantity of volume or surface. No reliable
Autor:
Jean Michel Desmarres, Cedric Seguineau, Olivier Dalverny, Julien Martegoutte, Talal Masri, Xavier Lafontan, Joël Alexis, Thibaut Fourcade
Publikováno v:
SPIE Proceedings.
The mechanical properties of two aluminium thin films manufactured by two different laboratories were investigated using in-plane uniaxial tensile stress. The geometrical parameters, in particular film thickness, were accurately measured and their in
Autor:
Thibaut Fourcade, P. Martins, Xavier Lafontan, Jean-Michel Desmarres, C. Malhaire, Cedric Seguineau, J. Martegoutte
Publikováno v:
EPJ Web of Conferences, Vol 6, p 26009 (2010)
EPJ Web of Conferences
EPJ Web of Conferences, EDP Sciences, 2010, 6, pp.26009
EPJ Web of Conferences
EPJ Web of Conferences, EDP Sciences, 2010, 6, pp.26009
Mechanical properties of freestanding electroplated gold thin films were studied in relationship to their geometrical and microstructural properties. Three different techniques of characterization were used: nanoindentation, bulge tests and microte
Autor:
Jean-François Le Neal, Jérémie Dhennin, Adrien Broue, David Veyrie, Xavier Lafontan, Francis Pressecq, Djemel Lellouchi
Publikováno v:
SPIE Proceedings.
Until now, the determination of the herm eticity of microelectronic packages is related to the MIL-STD-883 method 1014 which is based on the He leak detection method. But this method is no more suited for small packages due to the resolution limit of
Autor:
Adrien Broué, Frédéric Courtade, Je´re´mie Dhennin, Robert Plana, Christel Dieppedale, Xavier Lafontan, Patrick Pons
Publikováno v:
Journal of Micro/Nanolithography, MEMS, and MOEMS
Journal of Micro/Nanolithography, MEMS, and MOEMS, Society of Photo-optical Instrumentation Engineers, 2010, 9 (4), pp.041102-1 / 041102-8
Journal of Micro/Nanolithography, MEMS, and MOEMS, 2010, 9 (4), pp.041102-1 / 041102-8
Journal of Micro/Nanolithography, MEMS, and MOEMS, Society of Photo-optical Instrumentation Engineers, 2010, 9 (4), pp.041102-1 / 041102-8
Journal of Micro/Nanolithography, MEMS, and MOEMS, 2010, 9 (4), pp.041102-1 / 041102-8
International audience; Comparisons between several pairs of contact materials are done with a new methodology using a commercial nanoindenter coupled with electrical measurements on test vehicles specially designed to investigate microscale contact
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f944aeb771d45921d5ede69158c18a3b
https://hal.archives-ouvertes.fr/hal-00624780
https://hal.archives-ouvertes.fr/hal-00624780
Publikováno v:
2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.
The use of MEMS is becoming more common in consumer products such as game consoles. But for high reliability domains such as space, there is still a long path. Consequently, the support for process and failure analysis of MEMS devices requires adapte