Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Xavier F. Brun"'
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
New challenges in packaging arise as the pitch of the first-level-interconnects shrinks below what can be achieved with solder joints. Hybrid bonding, including direct Cu-Cu bonding, is a promising solution but faces significant integration challenge
Autor:
Hsin-Wei Wang, Elliott Capsuto, Michihiro Sugo, Xavier F. Brun, Hideto Kato, Patel Jigneshkumar P, Dingying Xu, Kosuke Hirota
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Heterogeneous integration gained significant momentum in the semiconductor industry as it compliments lithographic scaling and offers alternative pathways to device improvement. Temporary bond debond technology (TBDB) with a glass carrier provides a
Autor:
B. Martel, Nicolas Enjalbert, P. Bonnard, M. Cascant, G. Raymond, Sébastien Dubois, E. Letty, Xavier F. Brun, Jordi Veirman, T. Desrues, C. Picoulet, A. Danel, R. Peyronnet
Publikováno v:
Solar Energy Materials and Solar Cells. 158:55-59
A significant fraction of Czochralski (Cz) Silicon (Si) wafers suffer from oxygen-related bulk quality issues. The detection of such wafers in the as-cut state during incoming inspection has become a topic of attention as higher efficiency solar cell
Autor:
Xavier F. Brun, Shreyes N. Melkote
Publikováno v:
Solar Energy Materials and Solar Cells. 93:1238-1247
A significant challenge in using thinner and larger crystalline silicon wafers for solar cell manufacture is the reduced yield due to higher wafer breakage rates. At a given process step, wafer/cell breakage depends on the stresses produced in the wa
Autor:
Shreyes N. Melkote, Xavier F. Brun
Publikováno v:
Wear. 265:34-41
This paper addresses the influence of the partial slip phenomenon on the dynamic motion of a spherical workpiece held in a fixture with application to machining fixture design. The model considers the effect of interfacial slip damping arising from p
Autor:
Sébastien Dubois, P. Bonnard, M. Tomassini, G. Raymond, Jordi Veirman, Benoit Martel, Xavier F. Brun, M. Cascant, R. Peyronnet, Nicolas Enjalbert, J. Stadler, E. Fayard
Publikováno v:
2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC).
In this paper a new characterization technique, the OXYMAP technology, allowing measurement of the interstitial oxygen concentration and the oxygen related defects in Czochralski grown silicon, is presented. We applied this technique to 8 inch indust
Autor:
Xavier F. Brun, Shreyes N. Melkote
Publikováno v:
Journal of Manufacturing Science and Engineering. 131
This paper presents the modeling and prediction of the air flow, pressure, and holding (or lifting) force produced by a noncontact Bernoulli gripper, which is essentially a radial air flow nozzle used to handle small and large rigid and nonrigid mate
Autor:
Xavier F. Brun, Shreyes N. Melkote
Publikováno v:
2006 IEEE 4th World Conference on Photovoltaic Energy Conference.
The Manufacturing Research Center at Georgia Tech is addressing both fundamental and practical issues related to the handling of polycrystalline silicon wafers used in the manufacture of photovoltaic (PV) cells and modules. As Bernoulli grippers are